DF2166VT33 Renesas Electronics America, DF2166VT33 Datasheet - Page 705

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VT33

Manufacturer Part Number
DF2166VT33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VT33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Table 20.8 (4)
Item
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SCO = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Operation for
Settings of Erasure
Parameter
Useable Area for Erasure in User Boot Mode
On-chip
RAM
Storable/Executable Area
User Boot
MAT
×
×
×
×
×
×
External Space
(Expanded Mode)
×
×
×
Rev. 3.00, 03/04, page 663 of 830
User
MAT
Selected MAT
User
Boot
MAT
Embedded
Program
Storage Area

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