DF2166VT33 Renesas Electronics America, DF2166VT33 Datasheet - Page 842
DF2166VT33
Manufacturer Part Number
DF2166VT33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.HS2168EPI61H-U.pdf
(876 pages)
Specifications of DF2166VT33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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25.3.4
Table 25.9 shows the Multiplex bus interface timing. In subclock (φSUB = 32.768 kHz) operation,
external expansion mode operation cannot be guaranteed.
Table 25.9 Multiplex Bus Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Rev. 3.00, 03/04, page 800 of 830
Item
Address delay time
Address setup time 2
Address hold time 2
CS delay time (IOS,
CS256, CPCS1)
AH delay time
RD delay time 1
RD delay time 2
Read data setup time
Read data hold time
Read data access time 2 t
Read data access time 4 t
Read data access time 6 t
Read data access time 7 t
WR delay time 1
WR delay time 2
WR pulse width time 1
WR pulse width time 2
Write data delay time
Write data setup time
Write data hold time
Multiplex Bus Timing
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AD
AS2
AH2
CSD
AHD
RSD1
RSD2
RDS
RDH
ACC2
ACC4
ACC6
ACC7
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
Min..
—
0.5 × t
1.0 × t
—
—
—
—
15
0
—
—
—
—
—
—
1.0 × t
1.5 × t
—
0
0.5 × t
cyc
cyc
cyc
cyc
cyc
− 15
− 10
− 20
− 20
− 5
Max.
15
—
—
15
15
15
15
—
—
1.5 × t
2.5 × t
3.5 × t
4.5 × t
15
15
—
—
25
—
—
cyc
cyc
cyc
cyc
− 25
− 25
− 25
− 25
Unit
ns
Test Conditions
Figures 25.17,
25.18
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