STR912FW44X6 STMicroelectronics, STR912FW44X6 Datasheet - Page 54
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STR912FW44X6
Manufacturer Part Number
STR912FW44X6
Description
MCU 512K FLASH 96K SRAM USB CAN
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet
1.STR910FM32X6.pdf
(73 pages)
Specifications of STR912FW44X6
Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
For Use With
497-8267 - BOARD EVAL BASED ON STR9MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2497-5859 - EVAL BRD FULL USB DONGLE STR912MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-5063-2
497-5063-2
497-5063-2ND
STR912FW44X6T
497-5063-2
497-5063-2ND
STR912FW44X6T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STR912FW44X6
Manufacturer:
ST
Quantity:
20 000
Electrical characteristics
6.11
6.11.1 Functional EMS (Electro Magnetic Susceptibility)
6.11.2 Electro Magnetic Interference (EMI)
Notes:
1. Data based on characterization results, not tested in production.
2. BGA and LQFP devices have similar EMI characteristics.
54/73
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed.
Table 17.
1. Data based on characterization results, not tested in production.
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This emission test is in line with the norm SAE J
1752/3 which specifies the board and the loading of each pin.
Table 18.
Symbol
Symbol
V
V
FESD
S
FFTB
EMI
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
with the IEC 1000-4-4 standard.
SS
through a 100pF capacitor, until a functional disturbance occurs. This test conforms
Voltage limits to be applied on
any I/O pin to induce a functional
disturbance
Fast transient voltage burst limits
to be applied through 100pF on
V
functional disturbance
DD
Peak level
EMS data
EMI data
Parameter
and V
DDQ
Parameter
pins to induce a
V
T
LQFP128 package
conforming to SAE J
1752/3
A
DDQ
=+25°C,
=3.3V, V
Conditions
DD
V
T
MHz/96MHz PLL
V
T
MHz/96 MHz PLL
conforms to IEC 1000-4-4
=1.8V,
A
A
DD
DD
=+25°C, f
=+25°C, f
=1.8V, V
=1.8V, V
0.1MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1GHz
SAE EMI Level
Frequency Band
Conditions
OSC
OSC
DDQ
DDQ
Monitored
/f
/f
=3.3V,
=3.3V,
CPUCLK
CPUCLK
=4
=4
4 MHz/ 96 MHz
[f
OSC
Neg.
-1
-4
Max vs.
(1)
(1)
/f
10
10
22
CPUCLK
4
DD,
Pos.
>2
4
(1)
(1)
STR91xF
V
]
DDQ
Unit
dBµV
Unit
kV
and
-