DSP56F803BU80 Freescale Semiconductor, DSP56F803BU80 Datasheet - Page 10

IC DSP 80MHZ 31.5K FLASH 100LQFP

DSP56F803BU80

Manufacturer Part Number
DSP56F803BU80
Description
IC DSP 80MHZ 31.5K FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet

Specifications of DSP56F803BU80

Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
16
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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2.2 Power and Ground Signals
10
No. of
No. of Pins
Pins
No. of Pins
2
5
1
1
6
1
VCAPC
Signal
Name
Signal Name
Signal Name
V
Supply
TCS
V
Signal
V
Type
SSA
V
SS
DDA
DD
State During
GND—These pins provide grounding for the internal structures of the chip, and should all
be attached to V
Analog Ground—This pin supplies an analog ground.
TCS—This Schmitt pin is reserved for factory use and must be tied to V
In block diagrams, this pin is considered an additional V
Power—These pins provide power to the internal structures of the chip, and should all
be attached to V
Analog Power—This pin is a dedicated power pin for the analog portion of the chip and
should be connected to a low noise 3.3V supply.
Supply
Reset
Table 2-4 Supply Capacitors
56F803 Technical Data, Rev. 16
Table 2-2 Power Inputs
Table 2-3 Grounds
VCAPC—Connect each pin to a 2.2 μF or greater bypass capacitor in
order to bypass the core logic voltage regulator (required for proper chip
operation). For more information, please refer to
SS.
DD.
Signal Description
Signal Description
Signal Description
SS.
Section
Freescale Semiconductor
SS
5.2.
for normal use.

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