DSP56F803BU80 Freescale Semiconductor, DSP56F803BU80 Datasheet - Page 29
DSP56F803BU80
Manufacturer Part Number
DSP56F803BU80
Description
IC DSP 80MHZ 31.5K FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet
1.DSP56F803BU80E.pdf
(52 pages)
Specifications of DSP56F803BU80
Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
16
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Freescale Semiconductor
Frequency of operation (external clock driver)
Clock Pulse Width
1. See
2. The high or low pulse width must be no smaller than 6.25ns or the chip will not function. However, the high pulse width
does not have to be any particular percent of the low pulse width.
3. Parameters listed are guaranteed by design.
External
Note: The midpoint is V
Clock
Figure 3-9
Operating Conditions:
Table 3-8 External Clock Operation Timing Requirements
Characteristic
2
for details on using the recommended connection of an external clock driver.
10%
,
50%
90%
3
t
PW
IL
+ (V
Figure 3-10 External Clock Timing
IH
– V
IL
V
56F803 Technical Data, Rev. 16
)/2.
SS
= V
1
t
PW
SSA
= 0 V, V
f
t
Symbol
osc
PW
DD
= V
DDA
6.25
Min
0
= 3.0–3.6 V, T
Typ
—
—
A
= –40° to +85°C
Max
80
—
3
External Clock Operation
10%
50%
90%
MHz
V
V
Unit
ns
IH
IL
29