DSP56F805FV80 Freescale Semiconductor, DSP56F805FV80 Datasheet - Page 21
DSP56F805FV80
Manufacturer Part Number
DSP56F805FV80
Description
IC DSP 80MHZ 31.5K FLASH 144LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet
1.DSP56F805FV80E.pdf
(56 pages)
Specifications of DSP56F805FV80
Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Notes:
Freescale Semiconductor
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Junction to center of case
1.
2.
3.
Voltage difference V
Voltage difference V
ADC reference voltage
Ambient operating temperature
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Characteristic
Characteristic
DD
SS
to V
to V
Table 3-2 Recommended Operating Conditions
SSA
DDA
Table 3-3 Thermal Characteristics
Four layer board
(2s2p)
Four layer board
(2s2p)
Comments
56F805 Technical Data, Rev. 16
θJC
Symbol
VREF
ΔV
ΔV
R
T
), was simulated to be equivalent to the measured values
θJA
DD
A
SS
) was simulated to be equivalent to the JEDEC
Symbol
P
R
R
(2s2p)
R
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJA
θJC
I/O
JT
D
Min
-0.1
-0.1
–40
2.7
P
D
User Determined
= (I
(TJ - TA) /R
144-pin LQFP
DD
6
Typ
Value
–
–
-
-
47.1
43.8
40.8
39.2
11.8
x V
1
DD
θ
+ P
JA
V
I/O
Max
0.1
0.1
85
DDA
)
General Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Unit
°C
V
V
V
Notes
4, 5
1,2
1,2
2
2
3
7
21