DF38122HWV Renesas Electronics America, DF38122HWV Datasheet - Page 668

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DF38122HWV

Manufacturer Part Number
DF38122HWV
Description
IC H8/38122 MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheet

Specifications of DF38122HWV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
50
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Appendix I Specifications of Chip Tray
The specifications of the chip tray for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020 are shown in figure I.1. The specifications of the chip tray for
the HCD64F38024 and HCD64F38024R are shown in figure I.2. The specifications of the chip
tray for the HCD64338024S, HCD64338023S, HCD64338022S, HCD64338021S, and
HCD64338020S are shown in figure I.3.
Rev. 8.00 Mar. 09, 2010 Page 646 of 658
REJ09B0042-0800
Figure I.1 Specifications of Chip Tray for the HCD64338024, HCD64338023,
X
Appendix I Specifications of Chip Tray
HCD64338022, HCD64338021, and HCD64338020
51
6.2 ± 0.1
X-X' cross section
4.5 ± 0.05
6.9 ± 0.1
Chip tray name
DAINIPPON-INK-&-CHEMICALS-INC.
Type: CT015
Carved code: TCT45-060P
X'
Chip direction
Chip
Type name
3.99
Unit: mm

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