MAX6478BL33AD3+T Maxim Integrated Products, MAX6478BL33AD3+T Datasheet - Page 12

• Manufacturer Part Number: MAX6478BL33AD3+T
• Description: IC LDO REG 300MA 3.3V/ADJ 6-UCSP
• Manufacturer: Maxim Integrated Products

Specifications of MAX6478BL33AD3+T

• Regulator Topology: Positive Fixed or Adjustable
• Voltage - Output: 3.3V, 1.25 ~ 5.5 V
• Voltage - Input: 2.5 ~ 5.5 V
• Voltage - Dropout (typical): 0.114V @ 300mA, -
• Number Of Regulators: 1
• Current - Output: 300mA (Min)
• Current - Limit (min): 450mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-UCSP®
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 5.5 V
• Output Voltage: 1.2 V to 5 V, 3.3 V
• Output Type: Adjustable, Fixed
• Dropout Voltage (max): 0.032 V at 50 mA
• Output Current: 0.3 A
• Line Regulation: 0.09 % / V
• Load Regulation: 0.2 %
• Voltage Regulation Accuracy: 1.1 %
• Maximum Power Dissipation: 840 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Reference Voltage: 1.229 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
For the SOT23 package, any pin except the SET pin
can be used as a heatsink. If the SET pin is used as a
heatsink, excessive parasitic capacitance can affect
stability. For the TDFN package, the exposed metal
pad on the back side of a package connects to GND of
the chip. This metal pad can be used as a heatsink.
For general UCSP package information and PC layout
considerations, refer to Maxim Application Note: Wafer-
Level Chip-Scale Package .
Table 1. Output Voltage Suffix Guide
Note: Factory-trimmed custom output voltages may be avail-
able; contact factory for availability.
12
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SUFFIX
285
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Power Dissipation Consideration
UCSP Consideration
VOLTAGE (V)
OUTPUT
2.85
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
The chip-scale package (UCSP) represents a unique
packaging form factor that might not perform equally to
a packaged product through traditional mechanical
reliability tests. CSP reliability is integrally linked to the
user’s assembly methods, circuit-board material, and
usage environment. The user should closely review
these areas when considering a CSP package.
Performance through operating life test and moisture
resistance remains uncompromised, because it is pri-
marily determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, forgoing
the inherent stress relief of a packaged product’s lead
frame. Solder-joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note on Maxim’s website at www.maxim-ic.com.
Table 2. Reset Threshold Accuracy Guide
Table 3. Reset Timeout Delay Guide
SUFFIX
SUFFIX
D1
D2
D3
D4
A
B
TIMEOUT PERIOD (ms)
UCSP Reliability
MINIMUM RESET
TOLERANCE (%)
V
OUT
1200
-12.5
150
2.5
-7.5
20
RESET