MCF5328CVM240 Freescale Semiconductor, MCF5328CVM240 Datasheet - Page 2

• Manufacturer Part Number: MCF5328CVM240
• Description: IC MCU 32BIT 240MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF5328CVM240

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Program Memory Size: 16KB
• Cpu Speed: 240MHz
• Embedded Interface Type: CAN, I2C, MAC, Ethernet, QSPI, UART
• Rohs Compliant: Yes
• Family Name: MPC5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

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2
3
4
5
2
MCF532x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . .3
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5
3.1
3.2
3.3
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .6
4.1
4.2
4.3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
5.1
5.2
5.3
5.4
5.5
5.6
5.7
PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Supply Voltage Sequencing and Separation Cautions . .5
3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .5
3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .6
Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pinout—256 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .14
Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .15
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .17
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .18
Oscillator and PLL Electrical Characteristics . . . . . . . .19
External Interface Timing Characteristics . . . . . . . . . . .20
5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
5.7.1 SDR SDRAM AC Timing Characteristics. . . . . .23
MCF532x ColdFire
Table of Contents
®
Microprocessor Data Sheet, Rev. 5
6
7
8
5.8
5.9
5.10 LCD Controller Timing Specifications . . . . . . . . . . . . . 30
5.11 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.12 ULPI Timing Specification . . . . . . . . . . . . . . . . . . . . . . 33
5.13 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 33
5.14 I
5.15 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 37
5.16 32-Bit Timer Module Timing Specifications . . . . . . . . . 39
5.17 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . 39
5.18 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 40
5.19 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 42
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.1
7.2
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.7.2 DDR SDRAM AC Timing Characteristics . . . . . 25
General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 28
Reset and Configuration Override Timing . . . . . . . . . . 29
5.15.1 MII Receive Signal Timing . . . . . . . . . . . . . . . . 37
5.15.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . 37
5.15.3 MII Async Inputs Signal Timing . . . . . . . . . . . . 38
5.15.4 MII Serial Management Channel Timing . . . . . 38
Package Dimensions—256 MAPBGA . . . . . . . . . . . . . 45
Package Dimensions—196 MAPBGA . . . . . . . . . . . . . 46
2
C Input/Output Timing Specifications . . . . . . . . . . . . 35
Freescale Semiconductor