SPBT2532C2.AT STMicroelectronics, SPBT2532C2.AT Datasheet - Page 21

IC BLUETOOTH VER 2.1 CLASS 2

SPBT2532C2.AT

Manufacturer Part Number
SPBT2532C2.AT
Description
IC BLUETOOTH VER 2.1 CLASS 2
Manufacturer
STMicroelectronics

Specifications of SPBT2532C2.AT

Frequency
2.4GHz
Data Rate - Maximum
2Mbps
Modulation Or Protocol
Bluetooth v2.1+EDR, Class 2 & 3
Applications
General Purpose
Power - Output
2dBm
Sensitivity
-85dBm
Voltage - Supply
2.8 V ~ 3.6 V
Data Interface
PCB, Surface Mount
Memory Size
256kB Flash, 48kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Wireless Frequency
2400 MHz to 2483.5 MHz
Interface Type
I2C, I2S, SPI, UART
Data Rate
2 Mbps
Modulation
AFH
Operating Voltage
2.8 V to 3.6 V
Antenna
Without Antenna
Board Size
10 mm x 13 mm
Operating Temperature Range
- 40 C to + 85 C
Output Power
4 mA
Security
128 bit Encryption
Technology/ Type
Class 2 Bluetooth Module
Processor Series
STLC2500
For Use With
497-10656 - BOARD DEMO BLUETOOTH SPBT2532C2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Transmitting
-
Current - Receiving
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
Bluetooth Devices
Other names
497-10539

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPBT2532C2.AT
Manufacturer:
ST
0
Part Number:
SPBT2532C2.AT2
Manufacturer:
Broadchip
Quantity:
16 000
Part Number:
SPBT2532C2.AT2
Manufacturer:
ST
0
SPBT2532C2.AT
10
Soldering
Soldering phase has to be executed with care: In order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 7.
Figure 14. Soldering
Average ramp up rate (T
Temperature min (T
Temperature max (T
Time (t
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp down rate
Time from 25 °C to peak temperature
L
S
min to t
Time maintained above:
Soldering
L
Profile feature
S
max) (t
S
Preheat
S
P
min)
)
max)
SMAX
S
)
Doc ID 16089 Rev 7
to T
P
)
P
)
PB-free assembly
8 minutes max
3°C / sec max
60-100 sec
240 + 0 °C
60-70 sec
10-20 sec
6 °C / sec
150 °C
200 °C
217 °C
Soldering
21/50

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