SI4431-B1-FM Silicon Laboratories Inc, SI4431-B1-FM Datasheet - Page 5

• Manufacturer Part Number: SI4431-B1-FM
• Description: IC TXRX 240-930MHZ -8-13DB 20QFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI4431-B1-FM

• Package / Case: 20-VQFN
• Mfg Application Notes: Transitioning SI4430/31 to Rev B
• Frequency: 240MHz ~ 930MHz
• Data Rate - Maximum: 256kbps
• Modulation Or Protocol: FSK, GFSK, OOK
• Applications: General Purpose
• Power - Output: 13dBm
• Sensitivity: -121dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 18.5mA
• Current - Transmitting: 30mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Wireless Frequency: 240 MHz to 930 MHz
• Output Power: 13 dBm
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Supply Current: 30 mA
• Minimum Operating Temperature: - 40 C
• Modulation: FSK, GFSK, OOK
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4mm
• Product Length (mm): 4mm
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Si4430/31/32-B1
L
F
I S T OF
IGURES
Figure 1. Si4430/31 RX/TX Direct-Tie Application Example ..................................................... 16
Figure 2. Si4432 Antenna Diversity Application Example ......................................................... 16
Figure 3. SPI Timing.................................................................................................................. 18
Figure 4. SPI Timing—READ Mode ..........................................................................................19
Figure 5. SPI Timing—Burst Write Mode .................................................................................. 19
Figure 6. SPI Timing—Burst Read Mode .................................................................................. 19
Figure 7. State Machine Diagram.............................................................................................. 20
Figure 8. TX Timing................................................................................................................... 24
Figure 9. RX Timing .................................................................................................................. 24
Figure 10. Frequency Deviation ................................................................................................ 28
Figure 11. Sensitivity at 1% PER vs. Carrier Frequency Offset ................................................29
Figure 12. FSK vs GFSK Spectrums......................................................................................... 32
Figure 13. Direct Synchronous Mode Example......................................................................... 35
Figure 14. Direct Asynchronous Mode Example ....................................................................... 35
Figure 15. Microcontroller Connections..................................................................................... 36
Figure 16. PLL Synthesizer Block Diagram............................................................................... 38
Figure 17. FIFO Thresholds ...................................................................................................... 41
Figure 18. Packet Structure....................................................................................................... 42
Figure 19. Multiple Packets in TX Packet Handler .................................................................... 43
Figure 20. Required RX Packet Structure with Packet Handler Disabled ................................. 43
Figure 21. Multiple Packets in RX Packet Handler.................................................................... 43
Figure 22. Multiple Packets in RX with CRC or Header Error ................................................... 44
Figure 23. Operation of Data Whitening, Manchester Encoding, and CRC .............................. 46
Figure 24. Manchester Coding Example ...................................................................................46
Figure 25. Header ..................................................................................................................... 48
Figure 26. POR Glitch Parameters............................................................................................ 50
Figure 27. General Purpose ADC Architecture ......................................................................... 52
Figure 28. Temperature Ranges using ADC8 ........................................................................... 54
Figure 29. WUT Interrupt and WUT Operation.......................................................................... 57
Figure 30. Low Duty Cycle Mode .............................................................................................. 58
Figure 31. RSSI Value vs. Input Power..................................................................................... 61
Figure 32. TX/RX Direct-Tie Reference Design—Schematic.................................................... 62
Figure 33. 20-Pin Quad Flat No-Lead (QFN) ............................................................................69
Figure 34. PCB Land Pattern .................................................................................................... 70
Rev 1.1
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