SI4431-B1-FM Silicon Laboratories Inc, SI4431-B1-FM Datasheet - Page 71

• Manufacturer Part Number: SI4431-B1-FM
• Description: IC TXRX 240-930MHZ -8-13DB 20QFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI4431-B1-FM

• Package / Case: 20-VQFN
• Mfg Application Notes: Transitioning SI4430/31 to Rev B
• Frequency: 240MHz ~ 930MHz
• Data Rate - Maximum: 256kbps
• Modulation Or Protocol: FSK, GFSK, OOK
• Applications: General Purpose
• Power - Output: 13dBm
• Sensitivity: -121dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 18.5mA
• Current - Transmitting: 30mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Wireless Frequency: 240 MHz to 930 MHz
• Output Power: 13 dBm
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Supply Current: 30 mA
• Minimum Operating Temperature: - 40 C
• Modulation: FSK, GFSK, OOK
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4mm
• Product Length (mm): 4mm
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Notes: General
Note: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the
4. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
used for the center ground pad.
specification for small body components.
Symbol
C1
C2
X1
X2
Y1
Y2
E
Table 20. PCB Land Pattern Dimensions
Rev 1.1
3.90
3.90
0.20
2.65
0.65
2.65
Min
Millimeters
0.50 REF
Si4430/31/32-B1
Max
4.00
4.00
0.30
2.75
0.75
2.75
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