XC3S50AN-4TQ144I Xilinx Inc, XC3S50AN-4TQ144I Datasheet - Page 119
XC3S50AN-4TQ144I
Manufacturer Part Number
XC3S50AN-4TQ144I
Description
IC FPGA SPARTAN 3AN 144TQFP
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheet
1.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S50AN-4TQ144I
Number Of Logic Elements/cells
1584
Number Of Labs/clbs
176
Total Ram Bits
55296
Number Of I /o
108
Number Of Gates
50000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S50AN-4TQ144I
Manufacturer:
XILINX
Quantity:
760
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User I/Os by Bank
Table 83
The AWAKE pin is counted as a dual-purpose I/O.
Table 83: User I/Os Per Bank for the XC3S1400AN in the FGG676 Package
Footprint Migration Differences
The XC3S1400AN is the only Spartan-3AN FPGA offered in the FGG676 package. The XC3S1400AN FPGA is pin
compatible with the Spartan-3A XC3S1400A FPGA in the FG(G)676 package, although the Spartan-3A FPGA requires an
external configuration source.
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Package
Edge
Total
indicates how the 502 available user-I/O pins are distributed between the four I/O banks on the FGG676 package.
I/O Bank
0
1
2
3
Maximum I/Os
120
130
120
132
502
313
I/O
82
67
67
97
www.xilinx.com
INPUT
20
15
14
18
67
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
DUAL
30
21
52
1
0
VREF
10
10
38
9
9
CLK
32
8
8
8
8
119
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