XC3S200AN-4FT256I Xilinx Inc, XC3S200AN-4FT256I Datasheet - Page 77
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XC3S200AN-4FT256I
Manufacturer Part Number
XC3S200AN-4FT256I
Description
IC FPGA SPARTAN 3AN 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheet
1.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S200AN-4FT256I
Number Of Logic Elements/cells
4032
Number Of Labs/clbs
448
Total Ram Bits
294912
Number Of I /o
195
Number Of Gates
200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S200AN-4FT256I
Manufacturer:
MOLEX
Quantity:
2 000
Company:
Part Number:
XC3S200AN-4FT256I
Manufacturer:
XILINX
Quantity:
5 142
Company:
Part Number:
XC3S200AN-4FT256I
Manufacturer:
XILINX
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Company:
Part Number:
XC3S200AN-4FT256I
Manufacturer:
Xilinx Inc
Quantity:
10 000
User I/Os by Bank
Table 69
The AWAKE pin is counted as a dual-purpose I/O.
Table 69: User I/Os Per Bank for the XC3S50AN in the TQG144 Package
Footprint Migration Differences
The XC3S50AN FPGA is the only Spartan-3AN device offered in the TQG144 package. The XC3S50AN FPGA is pin
compatible with the Spartan-3A XC3S50A FPGA in the TQ(G)144 package, although the Spartan-3A FPGA requires an
external configuration source.
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Package
Edge
Total
indicates how the 108 available user-I/O pins are distributed between the four I/O banks on the TQG144 package.
I/O Bank
0
1
2
3
Maximum I/Os
108
27
25
30
26
I/O
14
11
15
42
2
www.xilinx.com
INPUT
1
0
0
1
2
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
DUAL
21
26
1
4
0
VREF
3
2
1
2
8
CLK
30
8
8
6
8
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