PK30X256VMD100 Freescale Semiconductor, PK30X256VMD100 Datasheet - Page 18

• Manufacturer Part Number: PK30X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK30X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART
• Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number Of I /o: 102
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Rohs Compliant: Yes
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 102
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

General
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
2. V
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
5.1.8 Capacitance attributes
5.2 Switching specifications
5.2.1 Device clock specifications
18
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
FB_CLK
Symbol
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
f
Symbol
FLASH
f
f
f
f
C
C
DD
SYS
BUS
SYS
BUS
IN_A
IN_D
= 3 V, T
System and core clock
Bus clock
FlexBus clock
Flash clock
System and core clock
Bus clock
Description
A
Input capacitance: analog pins
Input capacitance: digital pins
Description
= 25 °C, f
OSC
K30 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
= 12 MHz (crystal), f
Table 8. Capacitance attributes
Table continues on the next page...
SYS
Normal run mode
= 96 MHz
Preliminary
VLPR mode
Min.
—
—
—
—
—
—
Min.
—
—
Max.
100
50
50
25
2
2
Freescale Semiconductor, Inc.
Max.
7
7
MHz
MHz
MHz
MHz
MHz
MHz
Unit
Unit
Notes
pF
pF