UJA1079ATW/3V3/WD, NXP Semiconductors, UJA1079ATW/3V3/WD, Datasheet - Page 28

• Manufacturer Part Number: UJA1079ATW/3V3/WD,
• Description: IC SBC LIN 3.3V 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1079ATW/3V3/WD,

• Controller Type: System Basis Chip
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 28 V
• Current - Supply: 75µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
8. Thermal characteristics
UJA1079A
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
layer, board dimensions 129 mm × 60 mm, board material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 31 January 2011
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, board double
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
LIN core system basis chip
UJA1079A
© NXP B.V. 2011. All rights reserved.
015aaa137
Figure
14).
28 of 46