UJA1079ATW/3V3/WD, NXP Semiconductors, UJA1079ATW/3V3/WD, Datasheet - Page 42

• Manufacturer Part Number: UJA1079ATW/3V3/WD,
• Description: IC SBC LIN 3.3V 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1079ATW/3V3/WD,

• Controller Type: System Basis Chip
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 28 V
• Current - Supply: 75µA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
UJA1079A
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 19. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 31 January 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
LIN core system basis chip
temperature
peak
UJA1079A
© NXP B.V. 2011. All rights reserved.
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