UJA1061TW/3V3/C/T, NXP Semiconductors, UJA1061TW/3V3/C/T, Datasheet - Page 46

• Manufacturer Part Number: UJA1061TW/3V3/C/T,
• Description: IC CAN/LIN FAIL-SAFE HS 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1061TW/3V3/C/T,

• Applications: Automotive Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
8. Thermal characteristics
UJA1061_6
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
V1 dissipation
All information provided in this document is subject to legal disclaimers.
6 K/W
Rev. 06 — 9 March 2010
V2 dissipation
20 K/W
Fault-tolerant CAN/LIN fail-safe system basis chip
6 K/W
R th(c-a)
V3 dissipation
23 K/W
T
T
case
amb
(heat sink)
other dissipation
UJA1061
001aac327
© NXP B.V. 2010. All rights reserved.
6 K/W
T
vj
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