UJA1061TW/3V3/C/T, NXP Semiconductors, UJA1061TW/3V3/C/T, Datasheet - Page 69

• Manufacturer Part Number: UJA1061TW/3V3/C/T,
• Description: IC CAN/LIN FAIL-SAFE HS 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1061TW/3V3/C/T,

• Applications: Automotive Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
12. Package outline
Fig 28. Package outline SOT549-1 (HTSSOP32)
UJA1061_6
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 06 — 9 March 2010
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
Fault-tolerant CAN/LIN fail-safe system basis chip
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1061
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
69 of 77
A