UJA1061TW/3V3/C/T, NXP Semiconductors, UJA1061TW/3V3/C/T, Datasheet - Page 72

• Manufacturer Part Number: UJA1061TW/3V3/C/T,
• Description: IC CAN/LIN FAIL-SAFE HS 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1061TW/3V3/C/T,

• Applications: Automotive Networking
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 27 V
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
UJA1061_6
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 29. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 06 — 9 March 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Fault-tolerant CAN/LIN fail-safe system basis chip
temperature
peak
UJA1061
© NXP B.V. 2010. All rights reserved.
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