KIT33730EKEVBE Freescale Semiconductor, KIT33730EKEVBE Datasheet - Page 5

• Manufacturer Part Number: KIT33730EKEVBE
• Description: Power Management Modules & Development Tools SWITCH MODE PWR SUP
• Manufacturer: Freescale Semiconductor
• Type: Linear Regulators - Standardr

Specifications of KIT33730EKEVBE

• Product: Power Management Modules
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC33730
• Kit Application Type: Power Management
• Application Sub Type: SMPS
• Kit Contents: Board, CD
• Rohs Compliant: Yes
• For Use With/related Products: MC33730
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2. Maximum Ratings
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
Notes
Supply Voltage (VBAT)
Keep-Alive Supply Voltage (KA_VBAT)
Control Inputs (V
Bootstrap Voltage (BOOT, SR) referenced to ground
Bootstrap Voltage (BOOT, SR) referenced to SW
Charge Pump Output Voltage (CP)
Switch Node Voltage SW
Sensor Supplies (VREF1, VREF2)
Sensor Supplies (VREF1, VREF2) Maximum Slew Rate
Regulator Voltages (V
Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON)
Regon Input
Analog Inputs (VCOMP, INV, FREQ, HRT)
ESD Voltage
Operational Package Temperature (Ambient Temperature)
Storage Temperature
Peak Package Reflow Temperature During Reflow
Maximum Junction Temperature
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
2.
3.
4.
5.
6.
Human Body Model - HBM (all pins except BOOT, VDDL, RSTL)
Human Body Model - HBM (Pins BOOT, VDDL, RSTL)
Machine Model - MM (all pins)
Charge Device Model - CDM (all pins)
ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003),
R
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Thermal resistance measured in accordance with EIA/JESD51-2.
Theoretical thermal resistance from the die junction to the exposed pad.
ZAP
= 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).
(2)
IGN
, P1, P2, P3), PFD Output
DDH
,V
DD3
, V
DD3_B
Ratings
(6)
, V
(5)
ELECTRICAL CHARACTERISTICS
DDL
,V
DDL_B
(3),
(4)
MAXIMUM RATINGS
, V
KAM
)
V
V
BOOT
KA_V
REFMAXSR
Symbol
V
T
T
V
T
R θ
V
R θ
V
REGON
V
T
V
A_MAX
V
J_MAX
V
V
BOOT
PPRT
V
REG
STO
BAT
REF
ESD
SW
CP
DD
IN
J-C
J-A
- V
BAT
SW
ELECTRICAL CHARACTERISTICS
- 1.0 to +26.5
- 0.3 to +7.0
- 0.3 to + 3.0
- 40 to + 125
- 65 to + 150
- 0.3 to +7.0
-0.3 to +7.0
- 0.3 to +40
- 0.3 to +50
- 0.3 to +12
- 0.3 to +12
- 2.0 to +40
- 18 to +40
- 18 to +40
± 2000
± 1500
Value
Note 4
± 200
±750
150
2.0
1.2
41
MAXIMUM RATINGS
°C/W
°C/W
V/µs
Unit
°C
°C
°C
°C
V
V
V
V
V
V
V
V
V
V
V
V
V
33730
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