ML610Q432A-NNNTC03A7 Rohm Semiconductor, ML610Q432A-NNNTC03A7 Datasheet - Page 456

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ML610Q432A-NNNTC03A7

Manufacturer Part Number
ML610Q432A-NNNTC03A7
Description
MCU 8BIT 64K FLASH 128-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q432A-NNNTC03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
4.2MHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Chapter 26 Successive Approximation type A/D converter
• Operating conditions
[ ] Please confirm the operating voltage and the clock frequency.
• Others
[ ] Use the A/D converter when the HSCLK is oscillating.
[ ] Do not set SARUN bit of SADCON1 register to “1” on the condition both SACH0 bit and SACH1 bit of SADMOD0
register are “0” (Refer to Section 26.2.7 ~ Section 26.2).
Chapter 27 LCD driver
• Bias
[ ] 1/3 bias or [ ] 1/4 bias
• Duty
[ ] ML610Q431: 1/1 ~ 1/16 duty
[ ] ML610Q432: 1/1 ~ 1/24 duty
• COM/SEG
[ ] ML610Q431: 16COM x 64SEG
[ ] ML610Q432: 24COM x 64SEG
• External capacitor
(1/3 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF(connected between C1 and C2 pin), [ ] C34=1uF(connected between C3 and C4 pin)
(1/4 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cc=1uF(connected to VL3 pin), [ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF(connected between C1 and C2 pin), [ ] C34=1uF(connected between C3 and C4 pin)
Chapter 28 BLD (Battery Low Detector)
• Changing the threshold
[ ] Please select the threshold voltage when the BLD circuit is OFF.
Chapter 29 Power circuit
• External capacitor
[ ] CL0=1uF (connected to VDDL pin),
Chapter 30 On-chip debug
[ ] Supply 3.0V ~ 3.6V to VDD pin when programming (erasing and writing) the Flash ROM with Oki semiconductor
development tool uEASE.
[ ] Please do not apply LSIs being used for debugging to mass production.
[ ] Please validate the ROM code on your production board without Oki semiconductor development tool uEASE.
Appendix A SFR (Specific Function Registers)
• Initial data
[ ] Please confirm there are some SFRs have undefined initial value at reset (Refer to Appendix A in the user’s manual).
Appendix C Electrical Characteristics
• Operating temperature
[ ] -20’C to +70’C
• Operating voltage vs Operating frequency
[ ] Please confirm the operating conditions.
V
[ ] +1.1V to +3.6V (30kHz to 36kHz: Low-speed crystal oscillation clock operation)
[ ] +1.3V to +3.6V (30kHz to 625kHz: Built-in RC oscillation clock operation)
[ ] +1.8V to +3.6V (30kHz to 4.2MHz: High-speed crystal/ceramic oscillation clock or built-in PLL oscillation clock)
DD
=1.8V~3.6V (HSCLK=375KHz~1.1MHz or 1.99MHz~4.2MHz), AV
[ ] Cx =0.1uF (connected to VDDX pin)
E – 4
DD
=2.2V~3.6V
ML610Q431/ML610Q432 User’s Manual
Appendix E Check List

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