74LVC8T245BQ,118 NXP Semiconductors, 74LVC8T245BQ,118 Datasheet - Page 2

• Manufacturer Part Number: 74LVC8T245BQ,118
• Description: TXRX 8BIT TRANSLATING DHVQFN24
• Manufacturer: NXP Semiconductors

Specifications of 74LVC8T245BQ,118

• Logic Family: 74LVC
• Number Of Channels Per Chip: 2
• Propagation Delay Time: 5.4 ns, 8.9 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.2 V
• Maximum Operating Temperature: + 125 C
• Package / Case: DHVQFN-24
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5279-2

NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH8T245
Product data sheet
Type number
74LVC8T245PW
74LVCH8T245PW
74LVC8T245BQ
74LVCH8T245BQ
Fig 1.
DIR
OE
Logic symbol
22
2
Ordering information
V
CC(A)
Package
Temperature range
40 C to +125 C
40 C to +125 C








Suspend mode
Latch-up performance exceeds 100 mA per JESD 78B Class II
24 mA output drive (V
Inputs accept voltages up to 5.5 V
Low power consumption: 30 A maximum I
I
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
V
A1

OFF
CC(B)
3
60 Mbps (translate to 1.5 V)
circuitry provides partial Power-down mode operation
B1
21
A2
4
All information provided in this document is subject to legal disclaimers.
Name
TSSOP24
DHVQFN24 plastic dual in-line compatible thermal enhanced very
B2
20
Rev. 2 — 11 February 2011
A3
5
CC
B3
Description
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
thin quad flat package; no leads; 24 terminals;
body 3.5  5.5  0.85 mm
= 3.0 V)
74LVC8T245; 74LVCH8T245
19
A4
6
8-bit dual supply translating transceiver; 3-state
B4
18
A5
7
CC
B5
17
A6
8
B6
16
A7
9
B7
15
© NXP B.V. 2011. All rights reserved.
A8
10
Version
SOT355-1
SOT815-1
B8
001aai472
14
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