LCMXO256C-5TN100C LATTICE SEMICONDUCTOR, LCMXO256C-5TN100C Datasheet - Page 236
LCMXO256C-5TN100C
Manufacturer Part Number
LCMXO256C-5TN100C
Description
MACHXO PLD FLASH, SCRAM 1.8V, 256
Manufacturer
LATTICE SEMICONDUCTOR
Series
MachXOr
Datasheet
1.LCMXO1200C-5TN144C.pdf
(244 pages)
Specifications of LCMXO256C-5TN100C
Cpld Type
FLASH
No. Of Macrocells
128
No. Of I/o's
78
Propagation Delay
3.5ns
Global Clock Setup Time
1.3ns
Frequency
600MHz
Supply Voltage Range
1.71V To 3.465V
Operating
RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LCMXO256C-5TN100C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
Figure 14-11. CAM Artwork Screen Shots, Example #2, 256-ball caBGA
Layer 1 Primary
Layer 2 GND
Layer 3 Power
Layer 4 Secondary
PCB Fabrication Cost and Design Rule Considerations
PCB fabrication cost is a key consideration for many electronics products. By reviewing the IC device package ball
density and pitch, I/O signal requirements of your application, and the manufacturing constraints of your PCB fabri-
cation facility you can better weigh the trade-offs between design decisions.
Choosing the best package for your application involves answering a few questions:
• What is the driving factor in the application? The smallest possible form factor or a low PCB cost?
• How many I/O signals does the application require?
• What PCB layer stack up will provide the best I/O density within budget?
• What layout design rules does the printed-circuit board (PCB) vendor support?
• How many PCB layers does the budget allow?
As the ball pitch becomes smaller with each new BGA generation, new PCB fabrication techniques and signal via
type have been developed to handle the complexities. Micro vias, laser vias, filled, buried and blind vias, even bur-
ied and plated over vias. Complex boards use a combination of most of these.
14-13
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