PIC32MX360F256L-80I/BG Microchip Technology, PIC32MX360F256L-80I/BG Datasheet - Page 17
![IC, 32BIT MCU, PIC32, 80MHZ, BGA-100](/photos/12/13/121347/121-xbga_sml.jpg)
PIC32MX360F256L-80I/BG
Manufacturer Part Number
PIC32MX360F256L-80I/BG
Description
IC, 32BIT MCU, PIC32, 80MHZ, BGA-100
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.MA320002.pdf
(208 pages)
2.DM320001.pdf
(44 pages)
3.PIC32MX320F032H-40IPT.pdf
(48 pages)
4.PIC32MX320F032H-40IPT.pdf
(66 pages)
5.PIC32MX320F032H-40IPT.pdf
(22 pages)
6.PIC32MX320F064H-40IMR.pdf
(172 pages)
Specifications of PIC32MX360F256L-80I/BG
Controller Family/series
PIC32
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI
No. Of Pwm Channels
5
Core Size
32 Bit
Program Memory Size
256 KB
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
121-TFBGA
Embedded Interface Type
EUSART, I2C, SPI
Rohs Compliant
Yes
Processor Series
PIC32MX3xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
EUART, I2C, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320001, DM320002, MA320001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARD
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX360F256L-80I/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
64. Module: ADC
65. Module: Comparator
66. Module: Voltage Regulator
© 2010 Microchip Technology Inc.
When the ADC module is configured to start con-
version on an external interrupt (SSRC<2:0> =
001), the start of conversion always occurs on a
rising edge detected at the INT0 pin, even when
the INT0 pin has been configured to generate an
interrupt on a falling edge (INT0EP = 0).
Work around
Generate ADC conversion triggers on the rising
edge of the INT0 signal.
Alternatively, use external circuitry to invert the
signal appearing at the INT0 pin, so that a falling
edge of the input signal is detected as a rising
edge by the INT0 pin.
Affected Silicon Revisions
The Internal Voltage Reference (IV
1.2V (typical) instead of 0.6V as specified in the
device data sheet electrical specifications.
Work around
None.
Affected Silicon Revisions
Device may not exit BOR state if BOR event
occurs.
Work arounds
Work around 1:
V
(see parameter DC10 of the device data sheet).
Work around 2:
Reset device by providing POR condition.
Affected Silicon Revisions
DD
B2
B2
B2
X
X
X
must remain within the published specification
B3
B3
B3
X
X
B4
B4
B4
X
X
B6
B6
B6
X
X
REF
) is set to
PIC32MX3XX/4XX
DS80440D-page 17