MB91F669PMC-G-JNE1 Fujitsu, MB91F669PMC-G-JNE1 Datasheet - Page 23

• Manufacturer Part Number: MB91F669PMC-G-JNE1
• Description: MCU, 32BIT, FR80, 128K FLASH, 64LQFP
• Manufacturer: Fujitsu

Specifications of MB91F669PMC-G-JNE1

• No. Of I/o's: 50
• Ram Memory Size: 16KB
• Cpu Speed: 33MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 4
• Digital Ic Case: RoHS Compliant
• Core Size: 32bit
• Program Memory Size: 128KB
• Oscillator Type: Internal, External
• Controller Family/series: MB91665
• Rohs Compliant: Yes

 Surface Mount Type
 Lead-Free Packaging
 Storage of Semiconductor Devices
 Baking
 Static Electricity
DS07-16916-2E
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder reflow
method, and has established a ranking of mounting conditions for each product. Users are advised to mount
packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions.
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic sol-
dering, junction strength may be reduced under some conditions of use.
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will
cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture
can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the
following:
(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store
(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temper-
(3) When necessary, FUJITSU SEMICONDUCTOR packages semiconductor devices in highly moisture-resis-
(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the FUJITSU
SEMICONDUCTOR recommended conditions for baking.
Condition: 125 C/24 h
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the
following precautions:
(1) Maintain relative humidity in the working environment between 40% and 70%.
(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance
(4) Ground all fixtures and instruments, or protect with anti-static measures.
(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
products in locations where temperature changes are slight.
atures between 5 C and 30 C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
tant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate
bags for storage.
Use of an apparatus for ion generation may be needed to remove electricity.
(on the level of 1 M).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize
shock loads is recommended.
MB91665 Series
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