MB95F264KPF-G-SNE2 Fujitsu, MB95F264KPF-G-SNE2 Datasheet - Page 81

• Manufacturer Part Number: MB95F264KPF-G-SNE2
• Description: MCU, 8BIT, 20K FLASH, 8FX, 20SOP
• Manufacturer: Fujitsu

Specifications of MB95F264KPF-G-SNE2

• No. Of I/o's: 17
• Ram Memory Size: 496Byte
• Cpu Speed: 16.25MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 2
• Core Size: 8bit
• Program Memory Size: 20KB
• Oscillator Type: Internal, External
• Controller Family/series: MB95260H

■ PACKAGE DIMENSIONS
Please check the latest Package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS07–12627–6E
C
3.00
4.80(.189)MAX
2008-2010 FUJITSU SEMICONDUCTOR LIMITED D24066S-c-1-2
24-pin plastic SDIP
+0.20
– 0.30
(DIP-24P-M07)
.118
1.778(.070)
+.008
– .012
24
INDEX
1
24-pin plastic SDIP
(DIP-24P-M07)
#22.86 ± 0.10(.900 ± .004)
(.039 ±. 004)
1.00 ± 0.10
BTM E-MARK
MB95260H/270H/280H Series
0.43
.017
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
+0.09
– 0.04
+.004
– .002
13
12
Mounting height
Sealing method
Package width ×
package length
Lead pitch
0.50(.020)
(.252 ± .004)
MIN
6.40 ± 0.10
Dimensions in mm (inches).
Note: The values in parentheses are reference values
0.25
.010
+0.10
– 0.04
+.004
– .002
6.40 mm × 22.86 mm
7.62(.300)
TYP.
4.80 mm Max
Plastic mold
1.778 mm
(Continued)
81