MB95F264KPF-G-SNE2 Fujitsu, MB95F264KPF-G-SNE2 Datasheet - Page 83

• Manufacturer Part Number: MB95F264KPF-G-SNE2
• Description: MCU, 8BIT, 20K FLASH, 8FX, 20SOP
• Manufacturer: Fujitsu

Specifications of MB95F264KPF-G-SNE2

• No. Of I/o's: 17
• Ram Memory Size: 496Byte
• Cpu Speed: 16.25MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 2
• Core Size: 8bit
• Program Memory Size: 20KB
• Oscillator Type: Internal, External
• Controller Family/series: MB95260H

Please check the latest Package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS07–12627–6E
C
2008-2010 FUJITSU SEMICONDUCTOR LIMITED F20030S-c-1-2
1.27(.050)
20-pin plastic SOP
(FPT-20P-M09)
20
1
INDEX
0.10(.004)
#12.70 ± 0.10(.500 ± .004)
(FPT-20P-M09)
20-pin plastic SOP
BTM E-MARK
0.40
.016
+0.09
– 0.05
+.004
– .002
0.25(.010)
MB95260H/270H/280H Series
11
10
#7.50 ± 0.10
(.295 ± .004)
M
10.2
.402
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
+0.40
– 0.20
+.016
– .008
Mounting height
Sealing method
Package width ×
package length
Lead shape
Lead bend
Lead pitch
direction
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
"A"
0.25
.010
+0.07
– 0.02
+.003
– .001
Details of "A" part
0.80
.031
0~8°
2.52
.099
+0.47
– 0.30
+.019
– .012
+0.13
– 0.17
+.005
– .007
7.50 mm × 12.70 mm
(Mounting height)
2.65 mm Max
Normal bend
Plastic mold
1.27 mm
Gullwing
(.008 ± .004)
(Stand off)
0.20 ± 0.10
(Continued)
83