PIC18LF1330-I/ML Microchip Technology, PIC18LF1330-I/ML Datasheet - Page 297
![Microcontroller](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC18LF1330-I/ML
Manufacturer Part Number
PIC18LF1330-I/ML
Description
Microcontroller
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.AC162078.pdf
(318 pages)
3.PIC18F1230-ISO.pdf
(6 pages)
4.PIC18F1230-ISO.pdf
(12 pages)
5.PIC18F1230-ISO.pdf
(4 pages)
Specifications of PIC18LF1330-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- AC162078 PDF datasheet #2
- PIC18F1230-ISO PDF datasheet #3
- PIC18F1230-ISO PDF datasheet #4
- PIC18F1230-ISO PDF datasheet #5
- Current page: 297 of 318
- Download datasheet (3Mb)
2009 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
φ
2.05
0.10
0.25
0.40
0.20
0.31
MIN
L
0°
5°
5°
–
h
PIC18F1230/1330
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
h
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS39758D-page 297
c
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