TLE8209-2SA Infineon Technologies, TLE8209-2SA Datasheet
TLE8209-2SA
Specifications of TLE8209-2SA
Available stocks
Related parts for TLE8209-2SA
TLE8209-2SA Summary of contents
Page 1
...
Page 2
... Undervoltage Shut-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.9 Open Load Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9.1 General SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9.2 SPI Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 9.3 Electrical Characteristics SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 10 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 11 Package Outlines TLE8209-2SA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 12 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Data Sheet -Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TLE8209-2SA Table of Contents Rev. 1.0, 2010-02-16 ...
Page 3
... Green product (RoHS compliant) Functional Description The TLE8209-2SA is a SPI programmable H-bridge, designed for the control of DC motors in safety critical automotive applications. It features four selectable current ranges, two selectable slew rate settings and extensive diagnosis via SPI. The device monitors the digital supply voltage V over- or undervoltage, thus providing a safe switch off path in case of malfunction of the digital control circuitry ...
Page 4
... Pin Configuration 2.1 Pin Assignment GND VDDIO SS/SF OUT1 DIS GND Figure 1 Pinout TLE8209-2SA 2.2 Pin Definitions and Functions Pin Symbol Function in SPI Mode 1 GND Ground 2 SO SPI Serial Data Out VDDIO 3 Supply Voltage for Logic Output Buffer 4 SS/SF Slave Select (low active) ...
Page 5
... Pin Symbol Function in SPI Mode 17 SCK SPI Clock V VDD 18 supply DD 19 GNDABE Sense ground for 20 GND Ground 21 GND Heatslug - connect to GND 2.3 Terms IN1 V IN2 SCK Figure 2 Terms TLE8209-2SA Data Sheet V monitoring VDD I GNDS GNDS V GNDS IN1 IN2 I DIS DIS DIS ...
Page 6
... Block Diagram VDD VDD- Monitoring GNDABE IN1 Logic IN2 DIS ABE SO SI SCK SPI/Flag SS/SF VDDIO Figure 3 Block Diagram TLE8209-2SA Data Sheet VS CP internal Supply V S Undervoltage Gate Control Diagnostics GND 6 TLE8209-2SA Block Diagram OUT1 OUT2 Rev. 1.0, 2010-02-16 ...
Page 7
... V V -0.3 +5 -0.3 +0.3 V GNDABE GND GND ESD -8 8 -500 500 -750 750 7 TLE8209-2SA General Product Characteristics Unit Test Conditions / Comment C – 100h cumulative C – C – V Static destruction proof V Dynamic destruction proof t < 0.5 s (single pulse, T < jstart V – V – V – ...
Page 8
... Max 4.4 5. 5.5 V DDIO f – 11 kHz T -40 150 C J Symbol Limit Values Min. Typ. Max. R – – 1.6 thJC R – 17 – thJA 8 TLE8209-2SA General Product Characteristics Remark – – – – – Unit Remark K/W – 2) K/W Rev. 1.0, 2010-02-16 ...
Page 9
... Basic Supply Characteristics The TLE8209-2SA has three different supply pins: VDD, VS and VDDIO. VDD is used to supply the internal logic circuitry. VS connects to battery voltage and supplies the output stages. The voltage at pin VDDIO defines the high level output voltage at the pin SO of the SPI interface. VDDIO is also used as a mode select pin. If VDDIO is connected to ground, the device is set to status flag mode (SPI inactive) ...
Page 10
... SPI status flag (SF) diagnostic mode. As soon as device is put into status flag mode internal logic (SF-mode / SPI-mode) from internal logic V Figure 4 and SO-Pin DDIO Data Sheet + - SF/SPI - mode threshold V DDIO_L 10 TLE8209-2SA Power Supply lower than , the DDIO DDIO_L VDDIO SO Rev. 1.0, 2010-02-16 ...
Page 11
... DDIO_H V 0.2 0.5 DDIO_HYS V 5.25 5.4 DD_THH V 4.2 4.3 DD_THL V 4.2 4.3 DD_TEST_H V 5.25 5.4 DD_TEST_L t 60 100 FIL V – – DD_slew 11 TLE8209-2SA Power Supply -Monitoring DD Unit Test Conditions Max µ OUT DD V < < 125° bridge disabled OUT < < ...
Page 12
... ABE_INHY t 0.4 0.8 ABE ABE_L 0 – V -0.3 – SI_L V 2.0 – SI_H V 0.2 – SI_HYS I -30 - TLE8209-2SA Logic Inputs and Outputs Unit Test Conditions Max. 1.0 V – V +0.3 V – DD 1.0 V – V -10 µ < < 2.1 V INx V 5 µA > 3.0 V INx 1.0 V – ...
Page 13
... 300 – C – – 0.0 – SO_L V V -0.75 – SO_H DDIO C – – – TLE8209-2SA Logic Inputs and Outputs Unit Test Conditions Max. 1.0 V – V +0.3 V – DD 1.0 V – V -10 µ < < 2.1 V SCK 1.0 V – V +0.3 V – ...
Page 14
... Power Stages The TLE8209-2SA contains four n-channel power-DMOS transistors that can be used in an H-bridge or in dual half bridge configuration. Integrated circuits protect the outputs against overcurrent and over-temperature, in case of short-circuit to ground, to the supply voltage or across the load. Positive and negative voltage spikes, which occur when switching inductive loads, are limited by integrated freewheeling diodes (body diodes of power-DMOS) ...
Page 15
... TLE8209-2SA Power Stages Unit Test Conditions Max – 25°C OUTx 250 = 150°C OUTx – 25°C OUTx 240 = 3 A ...
Page 16
... C to 150 C, all voltages with respect to ground, positive current flowing j Symbol Limit Values Min. Typ. t – 8 ddis t – 38 ddis t – 8 del t – 38 del t – 0.1 del t RISE 90% 10% 30% 90% 16 TLE8209-2SA Power Stages Unit Test Conditions Max 8.. 0 --> output stage S active, no load t FALL 90% 10% 30% 10% t doff Rev. 1.0, 2010-02- OUT ...
Page 17
... I OUT 0 t ddis Figure 7 ABE pin - Enable and Disable Delay Time V 5 DIS OUT 0 t ddis Figure 8 DIS pin - Enable and Disable Delay Time Data Sheet 50% 10% t den 30% 10% t den 17 TLE8209-2SA Power Stages 50% t 90% t 30% t 90% t Rev. 1.0, 2010-02-16 ...
Page 18
... Diagnosis in Status Flag Mode Instead of using the SPI interface for control and diagnosis of the TLE8209-2SA, the device can also be set into status flag mode by connecting pin VDDIO to GND as described in In status flag mode the pin SF will be pulled low in the following cases: • ...
Page 19
... L tolerance of temperature dependent current reduction T ILR (typ. 165°C) short circuit detected < DF_H t DF_OFF 19 TLE8209-2SA Protection and Monitoring can be programmed 2.5 A typ. as shown in L_TSD range of over- temperature shut - down T T [° (min. 175°C) output off current tracking time tristate tristate ...
Page 20
... OUK T (see Figure 10). In that case, all output transistors are turned off. SD again, the device is returning to normal operation. UV_ON OUT1 OUT2 20 TLE8209-2SA Protection and Monitoring within the blanking time t . DF_H b . DF_OFF . DF_del , the outputs switches UV_OFF ...
Page 21
... Diagnostic H Load o.k. L Load o.k. H Open Load L Load o.k. VDD ref_M - + OUTx_L Diagnostic H o.k. L Open Load L o.k. 21 TLE8209-2SA Protection and Monitoring Comment pull down current is stronger transient area transient area OUTx OUTx_H + - V ref_H OUTx_L V + ref_L - Comment Load to ground Output open Load ...
Page 22
... OUKL1 2.0 4.0 OUKL2 1.8 3.5 OUKL3 2.0 5.1 OUKL4 L4 22 TLE8209-2SA Protection and Monitoring Unit Test Conditions Max 2.0 A -40 C < < j ILR Dependent on SPI 4.7 setting; Default = I 7.7 10 0.40 A -40 C < < j ILR 15 s – 130 s – ...
Page 23
... DIA_P 270 610 I -350 -240 DIA_N -350 -210 Ratio 2 2.9 I_DIA V 3.1 3.7 UV OFF V 3.3 3 100 200 – – TLE8209-2SA Protection and Monitoring Unit Test Conditions Max. 5 µs – 4 µs – – 40 µs 135 µs – 0 – 0.2 0 – 0.2 0 – ...
Page 24
... The TLE8209-2SA always operates in slave mode whereas the controller provides the master function. The maximum baud rate is 2 MBaud. By applying an active slave select signal at SS the TLE8209-2SA is selected by the SPI-master the data input (Slave In), SO the data output (Slave Out). Via SCK (Serial Clock Input) the SPI-clock is provided by the master ...
Page 25
... Instruction Byte The upper 2 bit of the instruction byte contain the chip address. The chip address of the TLE8209-2SA is ’00’. During read access, the output data according to the register requested in the instruction byte are applied to SO within the same SPI frame. That means, the output data corresponding to an instruction byte sent during one SPI ...
Page 26
... B SPI Instruction (encoding) Address sent by Correct addres is recognized, master is "00 " data transmitted Address sent by master remains tristated and SI data are ignored is different from "00 " TLE8209-2SA SPI Interface 2 1 INSTR2 INSTR1 Correct addres is not recognized Rev. 1.0, 2010-02-16 0 INSTR0 ...
Page 27
... The revision number may be utilized to distinguish different states of hardware and is updated with each redesign of the TLE8209-2SA divided into an upper 4 bit field reserved to define revisions (SWR) corresponding to specific software releases and a lower 4 bit field utilized to identify the actual mask set revision (MSR). ...
Page 28
... DIA20 2 r DIA11 1 r DIA10 0 r Data Sheet ID5 ID4 ID3 Description Device-ID TLE8209-2SA: DE hex SWR1 SWR0 MSR3 Description Revision corresponding to software release Revision corresponding to mask set Reset Value: x111 1111 CurrLim DIA21 Description Is set to “0” in case of ABE = L or DIS = H Is set to “ ...
Page 29
... Undervoltage at pin VS 0 open load (H-Bridge) 0 open load at OUT1 (single switch operation) X open load at OUT2 (single switch operation) 29 TLE8209-2SA SPI Interface Comment latched latched latched latched latched latched not latched latched latched latched Rev ...
Page 30
... Current Level (default) 4 Reset Value: 1101 1xxx DIACLR2 DIACLR1 Description VDD threshold test mode ’1’: VDD monitoring in normal operation ’0’: VDD thresholds are changed according to CONFIG1 30 TLE8209-2SA SPI Interface CL2 RESET Typical Current 1.5A 4.0A 6.6A 8. STATUS2 STATUS1 Rev ...
Page 31
... OUT1 always returns ’1’ at read access returns level at ABE ’0’: under voltage at VDD ’1’: VDD voltage above lower limit 0’: over voltage at VDD ’1’: VDD voltage below upper limit 31 TLE8209-2SA SPI Interface Rev. 1.0, 2010-02-16 ...
Page 32
... DIACLR1: Reset via SPI by writing 0 into the DIACLR1 of STATCON_REG DIACLR2: Reset via SPI by writing 0 into the DIACLR2 of STATCON_REG SFMODE: Reset by setting the TLE8209-2SA into the Status Flag Mode (VDDIO = 0V change Note reset condition is not listed for a particular register it has no effect on the contents of this register. ...
Page 33
... Bit (n-4)…1 Bit (n-3) Bit (n-2) Bit (n-3) Bit (n-4)…1 33 TLE8209-2SA Unit Test Conditions Typ. Max. – – ns referred to master – – ns referred to master – – ns referred to master C – 150 ns = 200 pF ...
Page 34
... VDD voltage regulator GND pin Figure 18 Application Example H-Bridge with SPI-Interface Data Sheet 10 nF 100nF TLE8209-2SA V DD ABE IN1 IN2 DIS µ SCK SS/ SF VDDIO GNDABE 34 TLE8209-2SA Application Information OUT1 OUT2 <33 nF <33 nF GND Rev. 1.0, 2010-02-16 M ...
Page 35
... Figure 20 Application Examples for Overvoltage and Reverse-Voltage Protection Data Sheet 10 nF 100 TLE8209-2SA V DD 47k ABE SS/ SF IN1 IN2 DIS SO SI SCK VDDIO GNDABE main 100µF relay 35 TLE8209-2SA Application Information OUT1 OUT2 <33 nF <33 nF GND V S 100 nF Rev. 1.0, 2010-02-16 M ...
Page 36
... Package Outlines TLE8209-2SA 1.1 ±0.1 1.27 +0.13 0.4 20 Index Marking 45˚ 1) Does not include plastic or metal protrusion of 0.15 max. per side Figure 21 PG-DSO-20-65 ( Plastic Dual Small Outline Package Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product ...
Page 37
... Initial Product Proposal 0.2 2008-12-05 - General: Package PG-DSO-20-37 (TLE8209-2SA) added - Page 13, Chapter 6: Description of digital inputs modified - Page 14, Pos. 6.0.36 & 6.0.37: typ. values removed - Page 16: Switching times adjusted to TLE8209-1 values - Page 36ff: Application diagrams updated (Figures 19 & 20) - Page 38: Package drawing added - Page 39: Package drawing updated 0 ...
Page 38
... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life ...