AD9779BSVZRL Analog Devices Inc, AD9779BSVZRL Datasheet - Page 8

IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,100PIN

AD9779BSVZRL

Manufacturer Part Number
AD9779BSVZRL
Description
IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,100PIN
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9779BSVZRL

Number Of Bits
16
Data Interface
Serial
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
300mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9779A-EBZ - BOARD EVALUATION FOR AD9779A
Settling Time
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9779BSVZRL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
AD9776/AD9778/AD9779
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
I
I
Aux
P1D15 to P1D0,
P2D15 to P2D0
DATACLK, TXENABLE
CLK+, CLK−
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
OUT1-P
OUT2-N
Range
2-P
, I
, Aux
, Aux
OUT1-N
1-P
2-N
, I
, Aux
OUT2-P
1-N
,
,
With
Respect
To
AGND,
DGND,
CGND
AGND,
DGND,
CGND
DGND,
CGND
AGND,
CGND
AGND,
DGND
AGND
AGND
DGND
DGND
CGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +1.98 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Rev. A | Page 8 of 56
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
100-lead, thermally enhanced TQFP_EP package, θ
with the bottom EPAD soldered to the PCB. With the bottom
EPAD not soldered to the PCB, θ
specifications are valid with no airflow movement.
ESD CAUTION
JA
= 27.4°C/W. These
JA
= 19.1°C/W

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