ADSP-21160NCB-100 Analog Devices Inc, ADSP-21160NCB-100 Datasheet - Page 51

• Manufacturer Part Number: ADSP-21160NCB-100
• Description: IC,DSP,32-BIT,CMOS,BGA,400PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21160NCB-100

• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 100MHz
• Non-volatile Memory: External
• On-chip Ram: 512kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.90V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Package: 400BGA
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 100 MHz
• Ram Size: 512 KB
• Device Million Instructions Per Second: 100 MIPS

ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21160x DSPs are provided in a 400-Ball PBGA (Plas-
tic Ball Grid Array) package.
The ADSP-21160x is specified for a case temperature (T
To ensure that the T
a heatsink and/or an air flow source may be used. Use the cen-
terblock of ground pins (for ADSP-21160M, PBGA balls:
H8-13, J8-13, K8-13, L8-13, M8-13, N8-13; for ADSP-21160N,
PBGA balls: F7-14, G7-14, H7-14, J7-14, K7-14, L7-14, M-14,
N7-14, P7-14, R7-15) to provide thermal pathways to the
printed circuit board’s ground plane. A heatsink should be
attached to the ground plane (as close as possible to the thermal
pathways) with a thermal adhesive.
Table 39. Airflow Over Package Versus θ
1
Airflow (Linear Ft./Min.)
θ
θ
JC
CA
• T
• PD = Power dissipation in W (this value depends upon the
• θ
• θ
= 3.6 °C/W
(°C/W)
of package)
specific application; a method for calculating PD is shown
under Power Dissipation).
CA
JB
CASE
= 6.46°C/W
= Value from
= Case temperature (measured on top surface
1
T
CASE
CASE
Table
=
data sheet specification is not exceeded,
T
AMB
39.
+
(
PD
0
12.13
×
θ
CA
CA
)
200
9.86
Rev. B | Page 51 of 60 | February 2010
400
8.7
CASE
).
ADSP-21160M/ADSP-21160N