CS47048C-CQZ Cirrus Logic Inc, CS47048C-CQZ Datasheet - Page 17

• Manufacturer Part Number: CS47048C-CQZ
• Description: IC 4CH ADC 8ch DAC & 32bit DSP
• Manufacturer: Cirrus Logic Inc
• Type: Fixed Pointr

Specifications of CS47048C-CQZ

• Interface: I²C, SPI
• Clock Rate: 150MHz
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad, 100-eLQFP, 100-HLQFP
• Operating Temperature Range: 0°C To +70°C
• No. Of Pins: 100
• Frequency: 147MHz
• Embedded Interface Type: I2C, SPI
• Core Supply Voltage: 1.89V
• No. Of Mips: 150
• Digital Ic Case Style: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 598-1539 - BOARD EVAL 4CH ADC/8CH DAC DSP598-1536 - BOARD EVAL 4CH ADC/8CH DAC DSP
• Non-volatile Memory: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 598-1657; CS47048B-CQZ

5.4 Power Supply Characteristics
5.5 Thermal Data (100-Pin LQFP with Exposed Pad)
DS787PP5
Operational Power Supply Current:
VDD: Core and I/O operating
VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
Thermal Resistance (Junction to Ambient)
Thermal Resistance (Junction to Top of Package)
Note:
Note:
Note:
1. Dependent on application firmware and DSP clock speed.
1. To calculate the die temperature for a given power dissipation:
2. To calculate the case temperature for a given power dissipation:


c
Measurements performed under operating conditions)
j
Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers and 0.5-oz. copper covering 90% of the internal power plane & ground plane layers.
= Ambient temperature + [ (Power Dissipation in Watts) *
=

j
- [ (Power Dissipation in Watts) * 
Parameter
1
Parameter
Four-layer Board
Four-layer Board
Two-layer Board
Two-layer Board
Copyright 2011 Cirrus Logic
jt
]
1
2
1
2
Symbol


ja
jt

ja
]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
0.54
Typ
.28
34
18
1025
1745
Typ
325
410
215
Audio SOC Processor Family
16
56
34
27
26
40
24
Max
CS470xx Data Sheet
-
-
-
-
Max
-
-
-
-
-
-
-
-
-
-
°C / Watt
°C / Watt
Unit
Unit
mW
mA
mA
mA
mA
mA
W
A
A
A
A
A
17