CS47048C-CQZ Cirrus Logic Inc, CS47048C-CQZ Datasheet - Page 17
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CS47048C-CQZ
Manufacturer Part Number
CS47048C-CQZ
Description
IC 4CH ADC 8ch DAC & 32bit DSP
Manufacturer
Cirrus Logic Inc
Type
Fixed Pointr
Specifications of CS47048C-CQZ
Interface
I²C, SPI
Clock Rate
150MHz
On-chip Ram
128kB
Voltage - I/o
3.30V
Voltage - Core
1.80V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad, 100-eLQFP, 100-HLQFP
Operating Temperature Range
0°C To +70°C
No. Of Pins
100
Frequency
147MHz
Embedded Interface Type
I2C, SPI
Core Supply Voltage
1.89V
No. Of Mips
150
Digital Ic Case Style
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
598-1539 - BOARD EVAL 4CH ADC/8CH DAC DSP598-1536 - BOARD EVAL 4CH ADC/8CH DAC DSP
Non-volatile Memory
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
598-1657
CS47048B-CQZ
CS47048B-CQZ
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CS47048C-CQZ
Manufacturer:
Cirrus Logic Inc
Quantity:
135
Company:
Part Number:
CS47048C-CQZ
Manufacturer:
Cirrus Logic Inc
Quantity:
10 000
Company:
Part Number:
CS47048C-CQZR
Manufacturer:
CIRRUS
Quantity:
1 400
Company:
Part Number:
CS47048C-CQZR
Manufacturer:
Cirrus Logic Inc
Quantity:
10 000
Part Number:
CS47048C-CQZR
Manufacturer:
CIRRUSLOGIC
Quantity:
20 000
5.4 Power Supply Characteristics
5.5 Thermal Data (100-Pin LQFP with Exposed Pad)
DS787PP5
Operational Power Supply Current:
VDD: Core and I/O operating
VDDA: PLL operating current
VDDA: DAC operating current (all 8 channels enabled)
VDDA: ADC operating current (all 4 channels enabled)
VDDIO: With most ports operating
Total Operational Power Dissipation:
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLLs halted
VDDA: DAC disabled
VDDA: ADC disabled
VDDIO: All connected I/O pins 3-stated by other ICs in system
Total Standby Power Dissipation:
Thermal Resistance (Junction to Ambient)
Thermal Resistance (Junction to Top of Package)
Note:
Note:
Note:
1. Dependent on application firmware and DSP clock speed.
1. To calculate the die temperature for a given power dissipation:
2. To calculate the case temperature for a given power dissipation:
c
Measurements performed under operating conditions)
j
Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20%
of the top & bottom layers and 0.5-oz. copper covering 90% of the internal power plane & ground plane layers.
= Ambient temperature + [ (Power Dissipation in Watts) *
=
j
- [ (Power Dissipation in Watts) *
Parameter
1
Parameter
Four-layer Board
Four-layer Board
Two-layer Board
Two-layer Board
Copyright 2011 Cirrus Logic
jt
]
1
2
1
2
Symbol
ja
jt
ja
]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
0.54
Typ
.28
34
18
1025
1745
Typ
325
410
215
Audio SOC Processor Family
16
56
34
27
26
40
24
Max
CS470xx Data Sheet
-
-
-
-
Max
-
-
-
-
-
-
-
-
-
-
°C / Watt
°C / Watt
Unit
Unit
mW
mA
mA
mA
mA
mA
W
A
A
A
A
A
17