DSPIC33FJ16GP101-I/SS Microchip Technology, DSPIC33FJ16GP101-I/SS Datasheet - Page 307
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC33FJ16GP101-I/SS
Manufacturer Part Number
DSPIC33FJ16GP101-I/SS
Description
16-bit DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 20 SSOP .209in TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ16GP101-IP.pdf
(322 pages)
Specifications of DSPIC33FJ16GP101-I/SS
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Core Processor
dsPIC
Core Size
16-Bit
Speed
16 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP (0.209", 5.30mm Width)
Lead Free Status / Rohs Status
Details
- Current page: 307 of 322
- Download datasheet (5Mb)
© 2011 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
DS70652C-page 307
b
K
e
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