CYII4SM1300AA-QDC Cypress Semiconductor Corp, CYII4SM1300AA-QDC Datasheet - Page 30

• Manufacturer Part Number: CYII4SM1300AA-QDC
• Description: SENSOR IMAGE MONO CMOS 84-LCC
• Manufacturer: Cypress Semiconductor Corp
• Type: CMOS Imagingr

Specifications of CYII4SM1300AA-QDC

• Package / Case: 84-LCC
• Pixel Size: 7µm² x 7µm²
• Active Pixel Array: 1286H x 1030V
• Frames Per Second: 7
• Voltage - Supply: 5V
• Operating Supply Voltage: 5 V
• Image Size: 1280 H x 1024 V
• Color Sensing: Black/White
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: IBIS4-1300-M-2; IBIS4-1300-M-2

Bonding Pad Geometry for the IBIS4-1300
■
■
Document Number: 38-05707 Rev. *C
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
The 84 pins are distributed evenly around the perimeter of the
Chip. At each edge there are 21 pins. Pin 1 is (in this drawing)
in the middle of the left edge.
The opening in the bonding pads (the useful area for bonding)
is 200 x 150 um.
No.
tri_adc
pbiasdig1
pbiasencload
pbiasdig2
nonlinear
n.c.
nbiasana2
nbiasana
vlow_adc
gnd_an
in_adc
vdd_an
gnd_dig
vdd_dig
vdd
gnd
vdd_resetr
L/R\
Pixel diode
Photodiode
clip
subsmpl
Name
D
A
A
A
D
A
A
A
A
A
A
D
D
A
A
A
D
A
A
A
D
Type
I
I
I
I
I
I
I
I
G
I
P
G
P
P
G
P
I
O
O
I
I
I/O
ADC output tristate control
100K to GND and decouple to VDD
100K to GND and decouple to VDD
100K to GND and decouple to VDD
high active (1 = non-linear conversion)
not connected
100K to VDD and decouple to GND
100K to VDD and decouple to GND
+ 2 V DC, +-2 K between P71 and P61
Converts between vlow and vhigh (2-4V) ADC input
+ 5 V DC
+ 5 V DC
+ 5 V DC
5 V DC default
(5.5 for large signal swing)
1=left; 0=right
groups current of 24 x 18 pixels
168x126 um2 (eq. 24 x 18 pixels)
Clips if output > 'clip' - Vth (PMOS)
high active, 1 = subsampling
Description
■
■
■
■
The centers of the bonding pads are at all four edges at 150
um distance from the nominal chip border.
The scribe line (=the spacing between the nominal borders of
neighboring chips) is 250 um.
The bonding pad pitch is 437 um in X-direction.
The bonding pad pitch in Y-direction is 393 um.
1=tristate; 0=output
current bias for comparator after encoder
current bias for encoder
current bias for digital logic in columns
control for non-linear behavior of sensor
bias current 2nd comparator stage
bias current 1st comparator stage
Low ADC reference voltage
ADC ground of analog circuits
ADC analog power supply
ADC ground of digital circuits
ADC digital power supply
Power supply for reset by right (readout) shift
register
Selects left or right shift register for 'select' and
'reset'
Test structure for spectral response
measurement of pixels
Test structure for spectral response
measurement of photodiode
Clipping voltage for output amplifier
Selects viewfinder mode (1:4 = 320 x 256)
CYII4SM1300AA
Signal
Page 30 of 35
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