IPA60R950C6 Infineon Technologies, IPA60R950C6 Datasheet - Page 5

• Manufacturer Part Number: IPA60R950C6
• Description: MOSFET N-CH 600V 4.4A TO220-FP
• Manufacturer: Infineon Technologies
• Series: CoolMOS™r

Specifications of IPA60R950C6

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 950 mOhm @ 1.5A, 10V
• Drain To Source Voltage (vdss): 600V
• Current - Continuous Drain (id) @ 25° C: 4.4A
• Vgs(th) (max) @ Id: 3.5V @ 130µA
• Gate Charge (qg) @ Vgs: 13nC @ 10V
• Input Capacitance (ciss) @ Vds: 280pF @ 100V
• Power - Max: 26W
• Mounting Type: Through Hole
• Package / Case: TO-220FP
• Transistor Polarity: N Channel
• Drain Source Voltage Vds: 600V
• On Resistance Rds(on): 0.86ohm
• Rds(on) Test Voltage Vgs: 10V
• Voltage Vgs Max: 30V
• Operating Temperature Range: -55°C To +150°C
• Transistor: RoHS Compliant
• Transistor Case Style: TO-220FP
• Rohs Compliant: Yes
• Resistance Drain-source Rds (on): 0.86 Ohms
• Drain-source Breakdown Voltage: 650 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 4.4 A
• Power Dissipation: 26 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 55 C
• Packages: PG-TO220-3
• Vds (max): 600.0 V
• Package: TO-220 FullPAK
• Rds(on) @ Tj=25°c Vgs=10: 950.0 mOhm
• Id(max) @ Tc=25°c: 4.4 A
• Idpuls (max): 12.0 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3
Table 3
Parameter
Thermal resistance, junction - case
Thermal resistance, junction -
ambient
Soldering temperature,
wavesoldering only allowed at
leads
Table 4
Parameter
Thermal resistance, junction - case
Thermal resistance, junction -
ambient
Soldering temperature,
wavesoldering only allowed at
leads
Table 5
Parameter
Thermal resistance, junction - case
Thermal resistance, junction -
ambient
Soldering temperature,
wave- & reflowsoldering allowed
1) Device on 40mm*40mm*1.5 epoxy PCB FR4 with 6cm
FinalData Sheet
vertical without air stream cooling
Thermal characteristics
Thermal characteristics TO-220 (IPP60R950C6)
Thermal characteristics TO-220FullPAK (IPA60R950C6)
Thermal characteristics TO-263 (IPB60R950C6),TO-252 (IPD60R950C6)
Symbol
R
R
T
Symbol
R
R
T
Symbol
R
R
T
sold
sold
sold
thJC
thJA
thJC
thJA
thJC
thJA
Min.
-
-
-
Min.
-
-
-
Min.
-
-
-
2
(one layer, 70µm thick) copper area for drain connection. PCB is
5
Typ.
-
-
-
Typ.
-
-
-
Typ.
-
-
35
-
Values
Values
Values
600V CoolMOS™ C6 Power Transistor
Max.
3.41
62
260
Max.
4.9
80
260
Max.
3.41
62
260
Unit
°C/W
°C
Unit
°C/W
°C
Unit
°C/W
°C
Thermal characteristics
Note /
Test Condition
leaded
1.6 mm (0.063 in.)
from case for 10 s
Note /
Test Condition
leaded
1.6 mm (0.063 in.)
from case for 10 s
Note /
Test Condition
SMD version, device
on PCB, minimal
footprint
SMD version, device
on PCB, 6cm
area
reflow MSL1
Rev. 2.1, 2010-03-11
1)
IPx60R950C6
2
cooling