MT47H64M8CF-25E IT:G Micron Technology Inc, MT47H64M8CF-25E IT:G Datasheet - Page 4

• Manufacturer Part Number: MT47H64M8CF-25E IT:G
• Description: 64MX8 DDR2 SDRAM PLASTIC IND TEMP FBGA 1.8V
• Manufacturer: Micron Technology Inc

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Electrical Specifications – Absolute Ratings ..................................................................................................... 21
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 43
ODT DC Electrical Characteristics ................................................................................................................... 44
Input Electrical Characteristics and Operating Conditions ............................................................................... 45
Output Electrical Characteristics and Operating Conditions ............................................................................. 48
Output Driver Characteristics ......................................................................................................................... 50
Power and Ground Clamp Characteristics ....................................................................................................... 54
AC Overshoot/Undershoot Specification ......................................................................................................... 55
Input Slew Rate Derating ................................................................................................................................ 57
Commands .................................................................................................................................................... 70
Mode Register (MR) ........................................................................................................................................ 76
Extended Mode Register (EMR) ....................................................................................................................... 81
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
Industrial Temperature ............................................................................................................................... 10
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 11
Package Dimensions ................................................................................................................................... 18
FBGA Package Capacitance ......................................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 21
I
I
Truth Tables ............................................................................................................................................... 70
DESELECT ................................................................................................................................................. 74
NO OPERATION (NOP) ............................................................................................................................... 75
LOAD MODE (LM) ...................................................................................................................................... 75
ACTIVATE .................................................................................................................................................. 75
READ ......................................................................................................................................................... 75
WRITE ....................................................................................................................................................... 75
PRECHARGE .............................................................................................................................................. 76
REFRESH ................................................................................................................................................... 76
SELF REFRESH ........................................................................................................................................... 76
Burst Length .............................................................................................................................................. 77
Burst Type .................................................................................................................................................. 78
Operating Mode ......................................................................................................................................... 78
DLL RESET ................................................................................................................................................. 78
Write Recovery ........................................................................................................................................... 79
Power-Down Mode ..................................................................................................................................... 79
CAS Latency (CL) ........................................................................................................................................ 80
DLL Enable/Disable ................................................................................................................................... 82
Output Drive Strength ................................................................................................................................ 82
DQS# Enable/Disable ................................................................................................................................. 82
RDQS Enable/Disable ................................................................................................................................. 82
Output Enable/Disable ............................................................................................................................... 82
On-Die Termination (ODT) ......................................................................................................................... 83
DD
DD7
Specifications and Conditions ............................................................................................................... 24
Conditions .......................................................................................................................................... 24
DD
Parameters ........................................................................................................ 24
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
2004 Micron Technology, Inc. All rights reserved.
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