MT48LC4M32B2TG-6:G Micron Technology Inc, MT48LC4M32B2TG-6:G Datasheet - Page 16

• Manufacturer Part Number: MT48LC4M32B2TG-6:G
• Description: DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 86-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC4M32B2TG-6:G

• Density: 128 Mb
• Maximum Clock Rate: 166 MHz
• Package: 86TSOP-II
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 17|7.5|5.5 ns
• Operating Temperature: 0 to 70 °C
• Organization: 4Mx32
• Address Bus: 14b
• Access Time (max): 17/7.5/5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 195mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Operating Mode
Write Burst Mode
Table 7:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
CAS Latency
The normal operating mode is selected by setting M7 and M8 to zero; the other combi-
nations of values for M7 and M8 are reserved for future use and/or test modes. The
programmed BL applies to both read and write bursts.
Test modes and reserved states should not be used because unknown operation or
incompatibility with future versions may result.
When M9 = 0, BL programmed via M0–M2 applies to both read and write bursts; when
M9 = 1, the programmed BL applies to read bursts, but write accesses are single-location
(nonburst) accesses.
Speed
-6
-7
16
CL = 1
≤ 50
≤ 50
Allowable Operating Frequency (MHz)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CL = 2
≤ 100
≤ 100
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition
CL = 3
≤ 166
≤ 143