MT48LC4M32B2TG-6:G Micron Technology Inc, MT48LC4M32B2TG-6:G Datasheet - Page 53

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MT48LC4M32B2TG-6:G

Manufacturer Part Number
MT48LC4M32B2TG-6:G
Description
DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2TG-6:G

Density
128 Mb
Maximum Clock Rate
166 MHz
Package
86TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|7.5|5.5 ns
Operating Temperature
0 to 70 °C
Organization
4Mx32
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
195mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M32B2TG-6:G
Manufacturer:
Micron
Quantity:
306
Figure 36:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
A0–A9, A11
Auto Refresh Mode
COMMAND
BA0, BA1
DQM 0-3
Notes:
A10
CKE
CLK
DQ
Precharge all
High-Z
t CKS
active banks
t CMS
t AS
SINGLE BANK
PRECHARGE
ALL BANKS
BANK(S)
T0
1.
t AH
t CKH
t CMH
t CK
t
commands must be applied on each positive clock edge during
RFC must not be interrupted by any executable command; COMMAND INHIBIT or NOP
t RP
T1
NOP
T2
REFRESH
AUTO
t CH
t RFC
53
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
t CL
Tn + 1
REFRESH
AUTO
t RFC
NOP
DON’T CARE
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©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
RFC.
To + 1
ACTIVE
ROW
ROW
BANK
Timing Diagrams
UNDEFINED

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