MT48LC4M32B2TG-6:G Micron Technology Inc, MT48LC4M32B2TG-6:G Datasheet - Page 29

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MT48LC4M32B2TG-6:G

Manufacturer Part Number
MT48LC4M32B2TG-6:G
Description
DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2TG-6:G

Density
128 Mb
Maximum Clock Rate
166 MHz
Package
86TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|7.5|5.5 ns
Operating Temperature
0 to 70 °C
Organization
4Mx32
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
195mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M32B2TG-6:G
Manufacturer:
Micron
Quantity:
306
Figure 17:
Figure 18:
Figure 19:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
WRITE Burst
WRITE-to-WRITE
Random WRITE Cycles
Notes:
Notes:
Notes:
COMMAND
1. BL = 2. DQM is LOW.
COMMAND
1. DQM is LOW. Each WRITE command may be to any bank.
COMMAND
1. Each WRITE command may be to any bank. DQM is LOW.
ADDRESS
ADDRESS
ADDRESS
CLK
CLK
CLK
DQ
DQ
DQ
WRITE
BANK,
COL n
WRITE
BANK,
BANK,
WRITE
COL n
COL n
T0
D
D
T0
D
n
T0
n
IN
IN
n
IN
WRITE
NOP
n + 1
BANK,
n + 1
COL a
T1
NOP
D
T1
D
T1
D
IN
a
IN
IN
DON’T CARE
WRITE
BANK,
WRITE
BANK,
NOP
COL b
COL x
T2
T2
D
D
T2
b
x
IN
IN
29
DON’T CARE
DON’T CARE
WRITE
BANK,
COL m
T3
NOP
T3
D
m
IN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition

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