MT48LC4M32B2TG-6:G Micron Technology Inc, MT48LC4M32B2TG-6:G Datasheet - Page 67

• Manufacturer Part Number: MT48LC4M32B2TG-6:G
• Description: DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 86-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC4M32B2TG-6:G

• Density: 128 Mb
• Maximum Clock Rate: 166 MHz
• Package: 86TSOP-II
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 17|7.5|5.5 ns
• Operating Temperature: 0 to 70 °C
• Organization: 4Mx32
• Address Bus: 14b
• Access Time (max): 17/7.5/5.5ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 195mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Figure 50:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
for production devices. Although considered final, these specifications are subject to change, as further product
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
A
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
0.25mm per side.
3.20
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
their respective owners.
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
67
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
BALL A1 ID