BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet
BGA 777L7 E6327
Specifications of BGA 777L7 E6327
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BGA 777L7 E6327 Summary of contents
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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BGA777L7 Revision History: 2009-07-02, V3.0 Previous Version: 2009-02-18, V1.0 preliminary Page Subjects (major changes since last revision) 7 Updated DC characteristics (added limits) 8 Added supply current and power gain characteristics 9 Updated RF characteristics for application board BGA7xxL7 and ...
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Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Description The BGA777L7 is a low current single-band low noise amplifier MMIC for UMTS bands 7, 38 and 40. The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile TSLP-7-1 leadless green ...
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Electrical Characteristics 2.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings Parameter Symbol V Supply voltage CC I Supply current CC V Pin voltage PIN V Pin voltage RF Input Pin RFIN P RF input power RFIN T Junction ...
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DC Characteristics Table 4 DC Characteristics, Parameter Symbol V Supply voltage CC I Supply current high gain CCHG mode I Supply current low gain CCLG mode I Supply current standby CCOFF mode V Logic level high HI V Logic ...
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Supply Current and Power Gain Characteristics; Supply current and power gain high gain mode versus reference resistor R reference resistor; low gain mode supply current is independent of reference resistor Supply Current = ...
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Measured RF Characteristics UMTS Band 7 Table 7 Typical Characteristics 2650 MHz Band T Parameter Pass band range band I Current consumption Gain 2) Reverse Isolation Noise figure 2) Input return loss 2) Output return loss 3) Stability factor ...
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Measured RF Characteristics UMTS Band 38 Table 8 Typical Characteristics 2600 MHz Band T Parameter Pass band range band I Current consumption Gain 2) Reverse Isolation Noise figure 2) Input return loss 2) Output return loss 3) Stability factor ...
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Measured RF Characteristics UMTS Band 40 Table 9 Typical Characteristics 2300 MHz Band T Parameter Pass band range band I Current consumption Gain 2) Reverse Isolation Noise figure 2) Input return loss 2) Output return loss 3) Stability factor ...
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Measured Performance Band 7 Application High Gain Mode vs. Frequency ° Power Gain | = ...
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Measured Performance Band 7 Application High Gain Mode vs. Temperature NF f Noise Figure = 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 2.62 2.63 2.64 2.65 2.66 2.67 2.68 2.69 Frequency [GHz] 2.13 Measured Performance ...
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NF T Noise Figure = 1.8 1.6 1.4 1.2 1 0.8 0.6 −40 − [°C] A 2.14 Measured Performance Band 7 Application Low Gain Mode vs. Frequency ...
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Matching | | = −5 −10 −15 −20 −25 −30 2.62 2.63 2.64 2.65 2.66 2.67 2.68 2.69 Frequency [GHz Noise Figure = f ...
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Measured Performance Band 7 Application Low Gain Mode vs. Temperature 2.15 Measured Performance Band 7 Application Low Gain Mode vs. Temperature 2 2 Power Gain ...
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Application Circuit and Block Diagram 3.1 UMTS Band 7 Application Circuit Schematic L1 C1 3.3nH 2.4pF RFIN 1 2600 MHz RFIN L2 3.9nH 2 VEN 2 ...
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UMTS Band 38 Application Circuit Schematic L1 C1 3.3nH 2.4pF RFIN 1 2500 MHz RFIN L2 4.1nH 2 VEN 2 VGS Figure 3 Application circuit ...
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UMTS Band 40 Application Circuit Schematic 10pF RFIN 1 2300 MHz RFIN L1 2.7nH 2 VEN 2 VGS Figure 4 Application ...
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Application Board Figure 5 Application board layout on 3-layer FR4. Top layer thickness: 0.2 mm, bottom layer thickness: 0.8 mm, 35 µm Cu metallization, gold plated. Board size Figure 6 Cross-section view of application board ...
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Figure 7 Detail of application board layout Note: In order to achieve the same performance as given in this datasheet please follow the suggested PCB-layout as closely as possible. The position of the GND vias is critical for RF performance. ...
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Physical Characteristics 4.1 Package Dimensions 1.4 0.3 0.3 0.3 Copper Solder mask Figure 8 Recommended footprint and stencil layout for the TSLP-7-1 package Top view Pin 1 marking 1) Dimension applies to plated terminal Figure 9 ...
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Figure 11 Marking layout Data Sheet BGA777L7 - Low Power Single-Band UMTS LNA 23 Physical Characteristics Package Dimensions V3.0, 2009-07-02 ...
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... Published by Infineon Technologies AG ...