BDN10-3CB/A01 CTS Thermal Management Products, BDN10-3CB/A01 Datasheet - Page 2

• Manufacturer Part Number: BDN10-3CB/A01
• Description: HEATSINK CPU W/ADHESIVE 1.01"SQ
• Manufacturer: CTS Thermal Management Products
• Series: BDNr

Specifications of BDN10-3CB/A01

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 25.65mm x 25.65mm
• Height: 0.35" (9mm)
• Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM
• Thermal Resistance @ Natural: 26.4°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Other names: 294-1098

PART NUMBER
BDN09-3CB/A01
BDN09-6CB/A01
BDN10-3CB/A01
BDN10-5CB/A01
BDN11-3CB/A01
BDN11-6CB/A01
BDN12-3CB/A01
BDN12-5CB/A01
BDN13-3CB/A01
BDN13-5CB/A01
BDN14-3CB/A01
BDN14-6CB/A01
BDN15-3CB/A01
BDN15-5CB/A01
BDN16-3CBA/01
BDN16-6CB/A01
BDN17-3CB/A01
BDN17-5CB/A01
BDN18-3CB/A01
BDN18-6CB/A01
BDN19-3CB/A01
BDN19-5CB/A01
HEAT SINK
0.91
1.01
1.11
1.21
1.31
1.41
1.51
1.61
1.71
1.81
1.91
(W)
0.91
1.01
1.11
1.21
1.31
1.41
1.51
1.61
1.71
1.81
1.91
(L)
SIZE
.355
.605
.355
.555
.355
.605
.355
.555
.355
.555
.355
.605
.355
.555
.355
.605
.355
.555
.355
.605
.355
.555
(H)
.09
.09
.09
.09
.09
.09
.09
.09
.09
.10
.09
.10
.09
.10
.10
.10
.10
.10
.10
.10
.10
.10
T
.069
.132
.083
.111
.076
.119
.060
.105
.074
.125
.067
.128
.062
.118
.072
.119
.065
.114
.072
.128
.069
.111
P
PIN FIN CONFIGURATION
.072
.128
.072
.114
.072
.128
.081
.114
.081
.114
.081
.128
.081
.114
.081
.128
.072
.114
.072
.114
.072
.114
G
FIN MATRIX
10X10
11X11
11X11
13X13
13X13
14X14
7X7
4X4
7X7
5X5
8X8
5X5
9X9
6X6
9X9
6X6
6X6
7X7
7X7
8X8
8X8
9X9
THERMAL RESISTANCE CASE
CONVECTION
NATURAL
TO AMBIENT ºC/WATTS
26.9
24.5
26.4
20.8
20.9
18.5
19.6
16.5
16.1
14.9
16.2
13.1
15.1
11.9
13.5
10.6
11.5
10.8
9.5
8.1
9.9
7.8
CONVECTION
@ 400 LFPM
FORCED
9.6
7.7
8.0
6.3
7.2
5.7
6.8
5.2
6.0
4.7
5.6
4.2
4.5
3.8
4.5
3.5
3.8
3.2
3.5
2.8
2.9
2.7