APF19-19-06CB/A01 CTS Thermal Management Products, APF19-19-06CB/A01 Datasheet - Page 2

HEATSINK FORGED W/ADHESIVE TAPE

APF19-19-06CB/A01

Manufacturer Part Number
APF19-19-06CB/A01
Description
HEATSINK FORGED W/ADHESIVE TAPE
Manufacturer
CTS Thermal Management Products
Series
APFr
Datasheet

Specifications of APF19-19-06CB/A01

Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
19.00mm x 19.00mm
Height
0.250" (6.35mm)
Thermal Resistance @ Forced Air Flow
7.0°C/W @ 200 LFM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Natural
-
Other names
294-1146
IERC a CTS Company
Page 2 of 2
Part Number Series
Dimensions in mm (L x W x H)
Commercial Black Anodize
Mounting Options
Adhesive
Double-sided Kapton®
Chomerics Thermattach®
Example:
APF19-19-10CB/A01
413 North Moss Street
APF 19-19-10 CB /A01
“/A01”
“T410, T411, or T412”
HOW TO ORDER?
Burbank, CA 91502
818-842-7277
www.ctscorp.com
October 2006

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