PA2-7CB CTS Thermal Management Products, PA2-7CB Datasheet

HEATSINK CLIP ON BLACK TO-220

PA2-7CB

Manufacturer Part Number
PA2-7CB
Description
HEATSINK CLIP ON BLACK TO-220
Manufacturer
CTS Thermal Management Products
Series
PA2-7r
Datasheet

Specifications of PA2-7CB

Package Cooled
TO-220
Attachment Method
Clip
Outline
25.40mm x 18.03mm
Height
0.31" (7.87mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Other names
294-1041
PA1-7
.Beryllium
dimensions
Dimensions
PA2-7
Dimensions are for reference use only. Contact IERC for
dimensions
(10.16)
(1.02)
(1.02)
vide high clamping pressure, which as-
sures low thermal resistance between
dissipator and semiconductor, allowing
vection to more than 400% in forced air.
a 150% power increase in natural con-
LI
Ti
AO
L
.04
L
T
.04
T
with tolerances
are for reference use only. Contact IERC for
with tolerances
copper clip is designed to pro-
-1-
-1-
(12.70)
J
f
,
(7.87)
.50
.31
(25.40)
1.00
\
or standard part drawings.
or standard part drawings.
-+1 (1'43) r--
-1 (11.43) 1'"-
145
145
Q
Q
Free-standing
I~
-1-
-1
-1
1--'
(MAX.)
(MAX.)
r
-1-
r
(5.08)
(5.08)
(965)
.20
20
38
(9.85)
.38
.Clip
.Free-standing
conductor to a customer designed heat
conduction plane.
either vertically or horizontally on board
heat dissipator and clip assembly
may be used alone to attach semi-
Ordering
Ordering Information
.Thermal
.Derate 2.4 °C/watt for unplated part in natural convection only.
.Thermal
.Derate
Disslpator
Clip
Disslpator
Clip
ITEM
ITEM
O
O
assembly can be mounted
2.4
Information
Resistance Case to Sink is 1.1.1.3 °C/W w/Joint Compound.
Resistance
°C/watt
1
1
Unplated
Unplated
PAl-7U
PVC-IU
PVC.IU
PA2.7U
POWER DISSIPATED (WATTS)
-I
POWER
2
2
for
Case
I
I cad'mlum
Cadmium
unplated
Black
N/A
PVC.IB
Black
N/A
PVC-IB
DISSIPATED
3
to Sink
3
IERC
IERC
part
4
PART
4
PART
is 1.1-1.3
Comm'l. Black
Comm'l.
Anodize
PAl-7CB
N/A
Anodize
PA2-7CB
N/A
in natural
NO.
NO.
(WATTS)
.Clip's
5
5
Black
-requires
hardware.
device and dissipator, stays attached
even in severe shock and vibration en-
vironments.
°C/W
convection
6
6
Mil. Black
w/Joint
Mil. Black
spring design firmly attaches to
Anodize
Anodize
PA1.7B
N/A
PA2-7B
N/A
no special tools or mounting
7
7
Compound.
only.
Semiconductor
Accommodated
Accommodated
A. N.C. Horiz. Device
A. N.C. Horiz. Device
B. N.C. Horiz. & Vert.
C. 200 FPM w/Diss.
E. 1000 FPM w/Diss.
Semiconductor
B. N.C. Horiz. & Vert.
C. 200 FPM w/Diss.
E. 1000 FPM w/Diss.
D. 500 FPM w/Diss.
D. 500 FPM w/Diss.
DESCRIPTION
Only Freestanding.
With Dissipator.
TO-202
TO-202
DESCRIPTION
Only Freestanding.
With Dissipator.
TO-202
TO-202
OF CURVES
OF CURVES
(Grams)
Weight
Max.
0.7
2.0
1.5
0.7
2.9

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