LA363B5CB CTS Thermal Management Products, LA363B5CB Datasheet

LA363B5CB

Manufacturer Part Number

LA363B5CB

Description

HEATSINK PWR 1.25"H BLACK TO-3

Manufacturer

CTS Thermal Management Products

Series

LA363B5r

Datasheet

1.LA363B5CB.pdf (2 pages)

Specifications of LA363B5CB

Package Cooled

TO-3

Attachment Method

Bolt On

Outline

41.40mm x 32.77mm

Height

1.250" (31.7mm)

Thermal Resistance @ Natural

11.1°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

Thermal Resistance @ Forced Air Flow

Other names

294-1092

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METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

LA363B5

Natural Conv. (°C/W): 11.1

Forced Air (°C/W): 3.9

Mounting Envelope: 1.63" x 1.29" x 1.25"

•

Thermal Resistance Case to Sink is 1.0-1.4 °C/W w/Joint Compound.

Derate 0.7 °C/watt for unplated part in natural convection only.

Technical

LA363B5

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

Related parts for LA363B5CB

LA363B5CB Summary of contents

Page 1

METAL CASE, CASE-MOUNTED SEMICONDUCTORS LA363B5 Natural Conv. (°C/W): 11.1 Forced Air (°C/W): 3.9 Mounting Envelope: 1.63" x 1.29" x 1.25" • Thermal Resistance Case to Sink is 1.0-1.4 °C/W w/Joint Compound. • Derate 0.7 °C/watt for unplated part in natural ...

Page 2

... Ordering Information CTS IERC PART NO. Unplated Comm'l. Black Anodize LA363B5U LA363B5CB 3. Hole pattern no. 363 accommodates T0-3s or T0-3 ICs. Available in LA-B series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Semiconductor Hole patt. ...

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