UJA1061TW/3V0,518 NXP Semiconductors, UJA1061TW/3V0,518 Datasheet - Page 71
UJA1061TW/3V0,518
Manufacturer Part Number
UJA1061TW/3V0,518
Description
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1061TW3V0518.pdf
(77 pages)
Specifications of UJA1061TW/3V0,518
Number Of Transceivers
1
Power Down Mode
Sleep/Standby
Operating Supply Voltage (min)
5.5V
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
- Current page: 71 of 77
- Download datasheet (513Kb)
NXP Semiconductors
UJA1061_6
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
29
29.
Rev. 06 — 9 March 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
Fault-tolerant CAN/LIN fail-safe system basis chip
3
3
)
)
Figure
350 to 2000
260
250
245
29) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
UJA1061
© NXP B.V. 2010. All rights reserved.
71 of 77
Related parts for UJA1061TW/3V0,518
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
UJA1061TW/HTSSOP32/REEL13DP//3
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Low speed CAN/LIN system basis chip
Manufacturer:
PHILIPS [NXP Semiconductors]
Datasheet:
Part Number:
Description:
Low Speed Can/lin System Basis Chip
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet: