HBLXT9785HE.B2 Intel, HBLXT9785HE.B2 Datasheet - Page 214
HBLXT9785HE.B2
Manufacturer Part Number
HBLXT9785HE.B2
Description
Manufacturer
Intel
Datasheet
1.HBLXT9785HE.B2.pdf
(221 pages)
Specifications of HBLXT9785HE.B2
Lead Free Status / RoHS Status
Not Compliant
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LXT9785/LXT9785E
Datasheet
249241, Revision 11.0
16 April 2007
Figure 66
Table 103
Cortina Systems
241-Ball BGA23 Package Specificationss - Bottom View (LXT9785BC)
241-Ball BGA23 Package Dimensions
®
Note:
LXT9785 and LXT9785E Advanced 8-Port 10/100 Mbps PHY Transceivers
Symbol
D1
A1
A2
E1
M
A
D
E
e
J
I
All dimensions and tolerances conform to ANSI Y14.5-1982. Dimension is
measured at maximum solder ball diameter parallel to primary datum (-C-).
Primary datum (-C-) and seating plane are defined by the spherical crowns
of the solder balls.
J
1.27 (solder ball pitch)
1.34 REF.
1.34 REF.
17 x 17 Matrix
e
b
22.90
19.30
22.90
19.30
2.19
0.50
1.12
Min
l
17
16
15
14
Nominal
13
23.00
19.50
23.00
19.50
2.38
0.60
1.17
12
11
10
Bottom View
241 BGA
9
8
23.10
19.70
23.10
19.70
Max
2.57
0.70
1.22
7
6
5
4
3
e
Units
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
2
1
8.0 Package Specifications
Pin A1 corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
Page 214
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