AM50DL128CG70I AMD (ADVANCED MICRO DEVICES), AM50DL128CG70I Datasheet - Page 61

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AM50DL128CG70I

Manufacturer Part Number
AM50DL128CG70I
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of AM50DL128CG70I

Lead Free Status / RoHS Status
Supplier Unconfirmed
PHYSICAL DIMENSIONS
FTA088—88-Ball Fine-Pitch Grid Array 11.6 x 8 mm
60
A
PACKAGE
JEDEC
SYMBOL
SD / SE
CORNER
MD
ME
A1
A2
D1
E1
eE
eD
0.15
(2X)
PIN A1
A
D
E
n
A2
b
A1
C
J1,J10,K1,K10,L1,L10,M3,M4,M5,M6,M7,M8
A3,A4,A5,A6,A7,A8,B1,B10,C1,C10,D1,D10
0.25
1.00
0.30
MIN
88X
---
E1,E10,F1,F10,G1,G10,H1,H10
11.60 mm x 8.00 mm
INDEX MARK
0.15
0.08
6
11.60 BSC.
10
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
FTA 088
b
M C
M C
NOM
0.35
N/A
12
10
88
---
---
---
A B
SIDE VIEW
TOP VIEW
MAX
1.40
1.11
0.40
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
P R E L I M I N A R Y
C
0.15
A
(2X)
Am50DL128CG
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
November 7, 2002
SE
CORNER
PIN A1
3237 \ 16-038.14b
7
E1

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