MT47H32M16GC-5E:B Micron Technology Inc, MT47H32M16GC-5E:B Datasheet - Page 20
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H32M16GC-5E:B
Manufacturer Part Number
MT47H32M16GC-5E:B
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16GC-5EB.pdf
(139 pages)
Specifications of MT47H32M16GC-5E:B
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
600ps
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
160mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
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Packaging
Package Dimensions
Figure 8: 84-Ball FBGA (12mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Seating
11.2
plane
0.12 C
Solder ball
diameter refers
to post-reflow
condition.
84X Ø0.45
C
Note:
12.0 ±0.15
1. All dimensions are in millimeters.
6.4
C L
TYP
0.8
C L
0.80 TYP
0.8 ±0.1
Ball A1 ID
20
12.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.2 MAX
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
Ball A1 ID location
© 2004 Micron Technology, Inc. All rights reserved.
Packaging
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